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通过光控化学镀在聚碳酸酯电泳芯片上制备用于安培检测的金微电极。

Fabrication of a gold microelectrode for amperometric detection on a polycarbonate electrophoresis chip by photodirected electroless plating.

作者信息

Kong Yong, Chen Hengwu, Wang Yurong, Soper Steven A

机构信息

Department of Chemistry, The Institute of Microanalytical Systems, Zhejiang University, Xixi Campous, Hangzhou, China.

出版信息

Electrophoresis. 2006 Jul;27(14):2940-50. doi: 10.1002/elps.200500750.

Abstract

A novel method of photoresist-free micropatterning coupled with electroless gold plating is described for the fabrication of an integrated gold electrode for electrochemical detection (ED) on a polycarbonate (PC) electrophoresis microchip. The microelectrode layout was photochemically patterned onto the surface of a PC plate by selective exposure of the surface coated without photoresist to 254 nm UV light through a chromium/quartz photomask. Thus, the PC plate was selectively sensitized by formation of reactive chemical moieties in the exposed areas. After a series of wet chemistry reactions, the UV-exposed area was activated with a layer of gold nanoparticles that served as a seed to catalyze the electroless plating. The gold microelectrode was then selectively plated onto the activated area by using an electroless gold plating bath. Nonselective gold deposition on the unwanted areas was eliminated by sonication of the activated PC plate in a KSCN solution before electroless plating, and the adhesion of the plated electrodes to the PC surface was strengthened with thermal annealing. Compared with the previously reported electroless plating technique for fabrication of microelectrodes on a microchip, the present method avoided the use of a membrane stencil with an electrode pattern to restrict the area to be wet-chemically sensitized. The CE with integrated ED (CE-ED) microchip was assembled by thermal bonding an electrode-plated PC cover plate to a microchannel-embossed PC substrate. The novel method allows one to fabricate low-cost, electrode-integrated, complete PC CE-ED chips with no need of a clean room. The fabricated CE-ED microchip was demonstrated for separation and detection of model analytes, including dopamine (DA) and catechol (CA). Detection limits of 0.65 and 1.03 microM were achieved for DA and CA, respectively, and theoretical plate number of 1.4 x 10(4) was obtained for DA. The plated gold electrode can be used for about 4 h, bearing usually more than 100 runs before complete failure.

摘要

本文描述了一种用于在聚碳酸酯(PC)电泳微芯片上制造用于电化学检测(ED)的集成金电极的新方法,该方法将无光刻胶微图案化与化学镀相结合。通过将未涂光刻胶的表面通过铬/石英光掩模选择性地暴露于254nm紫外光,将微电极布局光化学图案化到PC板表面上。因此,通过在暴露区域形成反应性化学基团,PC板被选择性地敏化。经过一系列湿化学反应后,用一层金纳米颗粒活化紫外光暴露区域,该金纳米颗粒用作催化化学镀的种子。然后通过使用化学镀金浴将金微电极选择性地镀到活化区域上。在化学镀之前,通过在KSCN溶液中超声处理活化的PC板,消除了在不需要区域上的非选择性金沉积,并通过热退火增强了镀覆电极与PC表面的附着力。与先前报道的用于在微芯片上制造微电极的化学镀技术相比,本方法避免了使用带有电极图案的膜模板来限制湿法化学敏化的区域。通过将镀有电极的PC盖板热键合到微通道压花的PC基板上,组装了具有集成ED的CE(CE-ED)微芯片。该新方法允许制造低成本、集成电极的完整PC CE-ED芯片,而无需洁净室。所制造的CE-ED微芯片用于分离和检测包括多巴胺(DA)和儿茶酚(CA)在内的模型分析物。DA和CA的检测限分别达到0.65和1.03 microM,DA的理论塔板数为1.4×10^4。镀覆的金电极可使用约4小时,通常在完全失效前可进行100多次运行。

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