Bassik Noy, Stern George M, Gracias David H
Appl Phys Lett. 2009 Aug 31;95(9):91901. doi: 10.1063/1.3212896.
Microassembly based on origami, the Japanese art of paper folding, presents an attractive methodology for constructing complex three-dimensional (3D) devices and advanced materials. A variety of functional structures have been created using patterned metallic, semiconducting, and polymeric thin films, but have been limited to those that curve in a single direction. We report a design framework that can be used to achieve spontaneous bidirectional folds with any desired angle, and we demonstrate theoretical and experimental realizations of complex 3D structures with +90 degrees , -90 degrees , +180 degrees , and -180 degrees folds. The strategy is parallel, versatile, and compatible with conventional microfabrication.
基于折纸术（日本的一种折纸艺术）的微组装为构建复杂的三维（3D）设备和先进材料提供了一种极具吸引力的方法。利用图案化的金属、半导体和聚合物薄膜已经创造出了各种功能结构，但这些结构仅限于在单一方向上弯曲的结构。我们报告了一个设计框架，该框架可用于实现具有任何所需角度的自发双向折叠，并且我们展示了具有 +90 度、-90 度、+180 度和 -180 度折叠的复杂 3D 结构的理论和实验实现。该策略具有并行性、通用性，并且与传统微加工兼容。
