Oregon Health & Science University, Portland, OR 97239, USA.
Angle Orthod. 2010 Jan;80(1):167-74. doi: 10.2319/010909-19.1.
To compare porcelain surfaces at debonding after use of two surface preparation methods and to evaluate a method for restoring the surface.
Lava Ceram feldspathic porcelain discs (n = 40) underwent one of two surface treatments prior to bonding orthodontic brackets. Half the discs had sandblasting, hydrofluoric acid, and silane (SB + HF + S), and the other half, phosphoric acid and silane (PA + S). Brackets were debonded using bracket removing pliers, and resin was removed with a 12-fluted carbide bur. The surface was refinished using a porcelain polishing kit, followed by diamond polishing paste. Measurements for surface roughness (Ra), gloss, and color were made before bonding (baseline), after debonding, and after each step of refinishing. Surfaces were also examined by scanning electron microscopy (SEM). Data was analyzed with 2-way ANOVA followed by Tukey HSD tests (alpha = 0.05).
The SB + HF + S bonding method increased Ra (0.160 to 1.121 microm), decreased gloss (41.3 to 3.7) and altered color (DeltaE = 4.37; P < .001). The PA + S method increased Ra (0.173 to 0.341 microm; P < .001), but the increase in Ra was significantly less than that caused by the SB + HF + S bonding method (P < . 001). The PA + S method caused insignificant changes in gloss (41.7 to 38.0) and color (DeltaE = 0.50). The measurements and SEM observations showed that changes were fully restored to baseline with refinishing.
The PA + S method caused significantly less damage to porcelain than the SB + HF + S method. The refinishing protocol fully restored the porcelain surfaces.
比较两种表面处理方法使用后的瓷表面脱粘，并评估一种修复表面的方法。
将 Lava Ceram 长石质烤瓷圆盘（n = 40）进行两种表面处理之一，然后再粘结正畸托槽。一半的圆盘进行喷砂、氢氟酸和硅烷处理（SB + HF + S），另一半进行磷酸和硅烷处理（PA + S）。使用托槽去除钳去除托槽，并用 12 齿碳化硅车针去除树脂。使用烤瓷抛光套件对表面进行再抛光，然后使用金刚石抛光膏。在粘结前（基线）、脱粘后以及每次再抛光后测量表面粗糙度（Ra）、光泽度和颜色。还通过扫描电子显微镜（SEM）检查表面。使用双因素方差分析（ANOVA）和 Tukey HSD 检验（alpha = 0.05）对数据进行分析。
SB + HF + S 粘结方法增加了 Ra（从 0.160 增加到 1.121 微米），降低了光泽度（从 41.3 降低到 3.7），并改变了颜色（DeltaE = 4.37；P <.001）。PA + S 方法增加了 Ra（从 0.173 增加到 0.341 微米；P <.001），但 Ra 的增加明显小于 SB + HF + S 粘结方法（P <.001）。PA + S 方法对光泽度（从 41.7 降低到 38.0）和颜色（DeltaE = 0.50）的影响不大。测量值和 SEM 观察表明，再抛光可完全恢复到基线。
PA + S 方法对瓷的损伤明显小于 SB + HF + S 方法。再抛光方案可完全恢复瓷表面。
