Towards circuit integration on fully flexible parylene substrates.

We present a substrate transfer technology which allows devices to be fully processed using conventional silicon-based fabrication techniques prior to their integration with parylene. A parylene-based metal microelectrode array with high-temperature silicon oxide passivation layers was demonstrated. Combining high quality devices from well-established processes with thin, flexible and biocompatible substrates, this technology could provide exciting opportunities, especially in biomedical applications such as implantable neural interfaces.