Wang Ke, van Deurzen Marice, Kooyman Nico, Decre Michel M J
Minimally Invasive Healthcare Department, Philips Research, Eindhoven, The Netherlands.
Annu Int Conf IEEE Eng Med Biol Soc. 2009;2009:5866-9. doi: 10.1109/IEMBS.2009.5334440.
We present a substrate transfer technology which allows devices to be fully processed using conventional silicon-based fabrication techniques prior to their integration with parylene. A parylene-based metal microelectrode array with high-temperature silicon oxide passivation layers was demonstrated. Combining high quality devices from well-established processes with thin, flexible and biocompatible substrates, this technology could provide exciting opportunities, especially in biomedical applications such as implantable neural interfaces.
我们展示了一种衬底转移技术，该技术允许器件在与聚对二甲苯集成之前，使用传统的硅基制造技术进行完全加工。展示了一种具有高温氧化硅钝化层的聚对二甲苯基金属微电极阵列。将成熟工艺制造的高质量器件与薄的、柔性的和生物相容性的衬底相结合，这项技术可以提供令人兴奋的机会，特别是在诸如植入式神经接口等生物医学应用中。
