Department of Pediatric Clinic, Faculty of Dentistry of Araraquara, UNESP, Araraquara, São Paulo, Brazil.
Orthod Craniofac Res. 2010 Feb;13(1):48-55. doi: 10.1111/j.1601-6343.2009.01474.x.
Evaluate the shear bond strength (SBS) and the adhesive remnant index (ARI) of indirect bonded lingual brackets using xenon plasma arc light, light-emitting diode (LED) and conventional quartz-tungsten-halogen light.
Lingual brackets were bonded indirectly to 60 premolars divided to three groups according to the curing light used: Group 1, plasma arc for 6 s; Group 2, LED for 10 s; and Group 3, halogen light for 40 s. After bonding, the specimens were subjected to a shear force until debonding. The debonding pattern was assessed and classified according to the ARI scores. The mean shear bond strengths were accessed by anova followed by the Student-Newman-Keuls test for multiple comparisons. ARI scores were assessed using the chi-square test.
The three groups showed significant differences (p < 0.001), with the averages of group 1 < group 2 < group 3. Groups showed no differences regarding ARI scores.
Bonding lingual brackets indirectly with plasma arc, during 60% of the time used for the LED, produced lower SBS than obtained with the latter. Using LED during 25% of the time of the halogen light produced lower SBS than obtained with the latter. These differences did not influence the debonding pattern and are clinically acceptable according to the literature.
评估使用氙气等离子弧光、发光二极管(LED)和传统的石英钨卤素光对间接粘接舌侧托槽的剪切粘结强度(SBS)和粘结残留指数(ARI)的影响。
将舌侧托槽间接粘接在 60 颗前磨牙上,根据使用的固化光将其分为三组:第 1 组,等离子弧光照射 6 秒;第 2 组,LED 光照射 10 秒;第 3 组,卤素光照射 40 秒。粘接后,试件受到剪切力直至脱粘。根据 ARI 评分评估脱粘模式并进行分类。通过方差分析和学生-纽曼-凯尔斯检验对多组进行多重比较,评估平均剪切粘结强度。使用卡方检验评估 ARI 评分。
三组之间存在显著差异(p < 0.001),组 1 的平均值低于组 2,组 2 低于组 3。各组的 ARI 评分无差异。
与使用 LED 光相比,在 LED 光照射时间的 60%内使用等离子弧光间接粘接舌侧托槽会产生较低的 SBS,但在卤素光照射时间的 25%内使用 LED 光会产生比卤素光更低的 SBS。这些差异不会影响脱粘模式,根据文献报道是临床可接受的。