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铜添加剂对硅酮植入物中黏附性表皮葡萄球菌数量和细胞活力的影响。

The effects of copper additives on the quantity and cell viability of adherent Staphylococcus epidermidis in silicone implants.

机构信息

Department of Cranio-Maxillo-Facial Surgery, University Medical Center, Regensburg, Germany.

出版信息

Biofouling. 2010 Apr;26(3):359-65. doi: 10.1080/08927011003629300.

DOI:10.1080/08927011003629300
PMID:20140797
Abstract

This in vitro study evaluated the antibacterial effect of copper additives in silicone implants. Specimens of a standard silicone material used in breast augmentation and modified copper-loaded silicone specimens were prepared and incubated in a Staphylococcus epidermidis suspension (2 h, 37 degrees C). After the quantification of adhering staphylococci using a biofluorescence assay (Resazurin), the viability of the adhering bacterial cells was quantified by live or dead cell labeling in combination with fluorescence microscopy. In the Resazurin fluorometric quantification, a higher amount of adhering S. epidermidis cells was detected on pure silicone (4612 [2319/7540] relative fluorescence units [rfu]) than on silicone with copper additives (2701 [2158/4153] rfu). Additionally, a significantly higher amount of adhering bacterial cells (5.07% [2.03%/8.93%]) was found for pure silicone than for silicone with copper additives (1.72% [1.26%/2.32%]); (p < 0.001). Calculations from live or dead staining showed that the percentage of dead S. epidermidis cells adhered on pure silicone (52.1%) was significantly lower than on silicone with copper additives (79.7%); (p < 0.001). In vitro, silicone material with copper additives showed antibacterial effects against S. epidermidis. Copper-loaded silicone may prevent bacterial colonization, resulting in lower infection rates of silicone implants.

摘要

本体外研究评估了硅酮植入物中铜添加剂的抗菌效果。制备了标准硅酮材料(用于隆胸)和改良的载铜硅酮标本,并将其在表皮葡萄球菌悬浮液(2 h,37°C)中孵育。使用生物荧光测定法(Resazurin)定量粘附的葡萄球菌后,通过活细胞或死细胞标记与荧光显微镜结合来定量粘附的细菌细胞的活力。在 Resazurin 荧光定量测定中,与添加铜的硅酮(2701 [2158/4153]相对荧光单位[rfu])相比,纯硅酮上检测到更多粘附的表皮葡萄球菌细胞(4612 [2319/7540] rfu)。此外,与添加铜的硅酮(1.72%[1.26%/2.32%])相比,纯硅酮上的粘附细菌细胞数量(5.07%[2.03%/8.93%])明显更高(p <0.001)。来自活细胞或死细胞染色的计算表明,粘附在纯硅酮上的表皮葡萄球菌细胞的死亡率(52.1%)明显低于添加铜的硅酮(79.7%)(p <0.001)。体外,含铜的硅酮材料对表皮葡萄球菌具有抗菌作用。载铜硅酮可能可以防止细菌定植,从而降低硅酮植入物的感染率。

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