Faculty of Dentistry, Federal University of Rio de Janeiro-UFRJ, Brazil.
Eur J Orthod. 2010 Oct;32(5):567-70. doi: 10.1093/ejo/cjp160. Epub 2010 Feb 17.
The purpose of this study was to compare the bond strengths and to evaluate the debonding site using the adhesive remnant index (ARI) provided by a conventional acid-etch conditioner and a new self-etching adhesive system, Xeno IV (Dentsply Caulk). One hundred and eighty bovine lower incisors were randomly divided into six groups (n = 30). In groups 1, 2, and 3, Transbond XT (3M Unitek) composite was used to bond the brackets to enamel samples conditioned with 37 per cent phosphoric acid + XT primer (3M Unitek), Xeno IV + XT primer, or Xeno IV only, respectively. In groups 4, 5, and 6, the bonding procedures were performed using Fuji Ortho LC (GC Corp.) resin-modified glass ionomer cement unconditioned, enamel conditioned with 37 per cent phosphoric acid, or Xeno IV, respectively. All samples underwent thermocycling and then shear bond strength (SBS) testing was performed using a universal testing machine (Emic DL 10.000). Analysis of variance was applied. For the post hoc test, the Tukey's test was used. Kruskal-Wallis and Mann-Whitney U-tests were used to assess ARI scores. The results demonstrated no statistical differences between groups 1, 2, and 3. However, statistically significant differences were found between these samples and groups 4, 5, and 6. With regard to ARI score, the highest mean value was found in group 5 (Fuji Ortho LC + 37 per cent acid conditioning), whereas group 4 (Fuji Ortho LC + no conditioning) had the lowest SBS. Xeno IV self-etching bonding agent was able to bond orthodontic brackets in association with Transbond XT composite as well as with Fuji Ortho LC, thus maximizing bracket bonding.
本研究的目的是比较使用传统酸蚀处理剂和新型自酸蚀黏结剂 Xeno IV（登士柏）提供的黏结强度，并通过黏结残留指数（ARI）评估离解部位。将 180 颗牛下切牙随机分为 6 组（n = 30）。在组 1、2 和 3 中，使用 Transbond XT（3M Unitek）复合树脂分别将托槽黏结到用 37%磷酸酸蚀剂+XT 底漆（3M Unitek）、Xeno IV+XT 底漆或 Xeno IV 预处理的釉质样本上。在组 4、5 和 6 中，分别使用未预处理的 Fuji Ortho LC（GC 公司）树脂改性玻璃离子水门汀、用 37%磷酸酸蚀剂预处理的釉质或 Xeno IV 进行黏结程序。所有样本均进行热循环，然后使用万能试验机（Emic DL 10.000）进行剪切黏结强度（SBS）测试。应用方差分析。对于事后检验，使用 Tukey 检验。采用 Kruskal-Wallis 和 Mann-Whitney U 检验评估 ARI 评分。结果表明，组 1、2 和 3 之间无统计学差异。然而，这些样本与组 4、5 和 6 之间存在统计学显著差异。关于 ARI 评分，值最高的是组 5（Fuji Ortho LC+37%酸处理），而 SBS 值最低的是组 4（Fuji Ortho LC+无处理）。Xeno IV 自酸蚀黏结剂能够与 Transbond XT 复合树脂以及 Fuji Ortho LC 一起黏结正畸托槽，从而最大限度地提高托槽黏结强度。
