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用于电极应用的热处理金/钯薄膜中固态反应的研究。

An investigation on solid state reactions in heat treated Au/Pd thin films for electrodes applications.

作者信息

Nazarpour Soroush, Cirera Albert, Ferrater Cesar, Ventura Jofre, Langenberg Eric, Jambois Olivier, Polo María del Carmen, García-Cuenca Maria Victoria, Varela Manuel

机构信息

Department of Applied Physics and Optics, University of Barcelona, 08028, Spain.

出版信息

J Nanosci Nanotechnol. 2010 Apr;10(4):2635-40. doi: 10.1166/jnn.2010.1404.

DOI:10.1166/jnn.2010.1404
PMID:20355476
Abstract

The interface between metals and oxides is particularly interesting. It has been the main topic of many research projects to illustrate that their properties are highly dependent on the structure of the interface. Poor adhesion between gold films and oxides is well known. On the basis of solid solution between the materials, the main effect of a Pd thin film as the adhesion layer between substrate and Au was investigated. Pure palladium and gold films were grown by electron beam evaporation sequentially on the SrTiO3 (001) single crystal substrates. After different annealing time (from 0.06 to 1.8 ks) at 500 degrees C, the growth sequence of the compositions between Au and Pd evolved as a results of the solid solution were investigated by means of X-ray photoelectron spectroscopy (XPS), X-ray diffraction. Meanwhile the surface morphology and the surface topography were examined respectively by scanning electron microscopy (SEM) and atomic force microscopy (AFM) observation. The effect of an intermediate Pd adhesion layer and its influence on the interfacial properties and morphology of the Au layer is investigated.

摘要

金属与氧化物之间的界面特别有趣。许多研究项目的主要课题都是阐明它们的性质高度依赖于界面结构。金膜与氧化物之间的附着力差是众所周知的。基于材料之间的固溶体,研究了钯薄膜作为衬底与金之间的粘附层的主要作用。通过电子束蒸发在SrTiO3(001)单晶衬底上依次生长纯钯和金膜。在500℃下经过不同的退火时间(从0.06到1.8 ks)后,借助X射线光电子能谱(XPS)、X射线衍射研究了由于固溶体导致的金和钯之间成分的生长顺序。同时,分别通过扫描电子显微镜(SEM)和原子力显微镜(AFM)观察来检测表面形貌和表面地形。研究了中间钯粘附层的作用及其对金层界面性质和形貌的影响。

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