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三齿四胺铜配合物在多孔硅骨架中的可逆氧配位。

Reversible coordination of dioxygen by tripodal tetraamine copper complexes incorporated in a porous silica framework.

机构信息

Institut de Chimie Moléculaire de l'Université de Bourgogne, UMR 5260, CNRS, Université de Bourgogne, 9 avenue Alain Savary, 21078 Dijon Cedex, France.

出版信息

Chemistry. 2010 Jun 1;16(21):6352-64. doi: 10.1002/chem.200903148.

Abstract

The present study reports the synthesis and rational design of porous structured materials by using a templating method. A tetraethoxysilylated tripodal tetraamine (TREN) was covalently incorporated in a silica framework with a double imprint: A surfactant template and a metal ion imprint. The presence of a cationic surfactant (CTAB) endowed the material with a high porosity, and the tripodal or square-pyramidal topology of the ligand was preserved thanks to the use of the silylated Cu(II) complex. After removal of the surfactant and de-metalation, the incorporated tetraamine was quantitatively complexed by CuCl(2) and the material has shown after thermal activation that a reversible binding of O(2) on the metal ions occurred. This chemisorption process was monitored by UV/Vis and EPR spectroscopies, and the Cu:O(2) adduct was postulated to be an end-on mu-eta(1):eta(1)-peroxodicopper(II) complex bridged by a chloride ion. The Cu(I)-active species, formed during the activation step, were fully recovered during several O(2) binding cycles. The high reactivity of the copper complexes and the room-temperature stability of the dioxygen adduct were explained by the fine adaptability of the tripodal ligand to different geometries, the confinement of the active sites in the hybrid silica that protect them from degradation by a control of the metal-ion microenvironment, as well as the short-range lamellar order of the copper complexes in the framework.

摘要

本研究报告了通过模板法合成和合理设计多孔结构材料。将四乙氧基硅烷化三脚架四胺(TREN)通过共价键结合到具有双重印迹的二氧化硅骨架中:表面活性剂模板和金属离子印迹。阳离子表面活性剂(CTAB)的存在赋予了材料高的孔隙率,并且由于使用了硅烷化的 Cu(II) 配合物,配体的三脚架或四方锥拓扑结构得以保留。去除表面活性剂和脱金属后,定量地将嵌入的四胺与 CuCl(2) 络合,并且该材料在热激活后显示出金属离子上的 O(2) 的可逆结合。通过 UV/Vis 和 EPR 光谱监测该化学吸附过程,并假设 Cu:O(2) 加合物是通过一个氯离子桥接的末端-on mu-eta(1):eta(1)-过氧二铜(II) 配合物。在活化步骤中形成的 Cu(I)-活性物质在几个 O(2)结合循环中得到完全回收。铜配合物的高反应性和氧气加合物的室温稳定性可以通过以下几点来解释:三脚架配体对不同几何形状的良好适应性、活性位点在保护它们免受金属离子微环境降解的杂化二氧化硅中的受限、以及铜配合物在骨架中的短程层状有序性。

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