Collaboratory for Advanced Computing and Simulations, Department of Physics & Astronomy, University of Southern California, Los Angeles, California 90089-0242, USA.
Phys Rev Lett. 2010 Apr 16;104(15):155502. doi: 10.1103/PhysRevLett.104.155502.
Impurities segregated to grain boundaries of a material essentially alter its fracture behavior. A prime example is sulfur segregation-induced embrittlement of nickel, where an observed relation between sulfur-induced amorphization of grain boundaries and embrittlement remains unexplained. Here, 48x10(6)-atom reactive-force-field molecular dynamics simulations provide the missing link. Namely, an order-of-magnitude reduction of grain-boundary shear strength due to amorphization, combined with tensile-strength reduction, allows the crack tip to always find an easy propagation path.
杂质在材料晶界的偏析从本质上改变了其断裂行为。一个主要的例子是硫偏析诱导的镍脆化,其中观察到的硫诱导晶界非晶化与脆化之间的关系仍然无法解释。在这里,48x10(6)-原子反应力场分子动力学模拟提供了缺失的环节。即,由于非晶化导致晶界剪切强度降低一个数量级,再加上拉伸强度降低,使得裂纹尖端总能找到一个容易扩展的路径。