Kirk C P
Appl Opt. 1987 Aug 15;26(16):3417-24. doi: 10.1364/AO.26.003417.
The effects of aberrations on the accuracy and repeatability of critical dimension measurements made with an optical microscope are examined theoretically and practically. Aberrations in microscope objectives are studied to determine their effects on the image profiles of narrow ($#x2248;2-microAm) line objects, such as the geometries on integrated circuits. A diffraction theory model is developed and used to investigate the effects of the primary aberrations. Microscope objectives from different manufacturers are examined, and agreement between the theoretical and practical image intensity profiles is demonstrated. It is concluded that the aberrations in many commercially available objective lenses introduce significant errors into semiconductor geometry measurements.
从理论和实践两方面研究了像差对光学显微镜进行关键尺寸测量的准确性和可重复性的影响。对显微镜物镜的像差进行了研究,以确定它们对窄(约2微米)线条物体(如集成电路上的几何图形)图像轮廓的影响。建立了一个衍射理论模型,并用于研究初级像差的影响。对不同制造商生产的显微镜物镜进行了检测,结果表明理论图像强度轮廓与实际图像强度轮廓相符。得出的结论是,许多市售物镜中的像差会给半导体几何尺寸测量带来重大误差。