Guha A, Bristow J, Sullivan C, Husain A
Appl Opt. 1990 Mar 10;29(8):1077-93. doi: 10.1364/AO.29.001077.
This paper presents a study of board-level interconnection requirements for highly parallel and massively parallel computing. Analytical models of the I/O bandwidth of popular interconnection networks have been developed and show that current electronic technologies are poor in supporting the necessary I/O density and bandwidth. Optical interconnects appear to offer greater potential in meeting these I/O requirements. Several possible optical implementations of interconnecting a network of electronic processors are compared. The use of polymer waveguides appears to offer the best solution compatible with existing multiboard system architectures.
本文介绍了一项针对高度并行和大规模并行计算的板级互连要求的研究。已开发出流行互连网络的I/O带宽分析模型，结果表明当前电子技术在支持必要的I/O密度和带宽方面表现不佳。光学互连在满足这些I/O要求方面似乎具有更大的潜力。比较了几种互连电子处理器网络的可能光学实现方式。聚合物波导的使用似乎提供了与现有多板系统架构兼容的最佳解决方案。
