School of Oral Hygiene, School of Dentistry, College of Oral Medicine, Taipei Medical University, Taiwan.
Eur J Orthod. 2011 Apr;33(2):180-4. doi: 10.1093/ejo/cjq056. Epub 2010 Aug 30.
The purpose of this study was to compare the bond strengths and debonded interfaces achieved with light-cured resin-modified glass ionomer cement (RMGIC) and conventional light-cured composite resin. In addition, the effects of acid etching and water contamination were examined. One hundred human premolars were randomly divided into five equal groups. The mini Dyna-lock upper premolar bracket was selected for testing. The first four groups were treated with light-cured RMGIC with or without 15 per cent phosphoric acid-etching treatment and with or without water contamination preceding bracket bonding. The control samples were treated with the conventional light-cured Transbond composite resin under acid etching and without water contamination. Subsequently, the brackets were debonded by tensile force using an Instron machine. The modified adhesive remnant index (ARI) scores were assigned to the bracket base of the debonded interfaces using a scanning electron microscope. The bond strength and modified ARI scores were determined and analysed statistically by one-way analysis of variance and chi-square test. Under all four conditions, the bond strength of the light-cure RMGIC was equal to or higher than that of the conventional composite resin. The highest bond strength was achieved when using RMGIC with acid etching but without water contamination. The modified ARI scores were 2 for Fuji Ortho LC and 3 for Transbond. No enamel detachment was found in any group. Fifteen per cent phosphoric acid etching without moistening the enamel of Fuji Ortho LC provided the more favourable bond strength. Enamel surfaces, with or without water contamination and with or without acid etching, had the same or a greater bond strength than Transbond.
本研究旨在比较光固化树脂改良型玻璃离子水门汀（RMGIC）和传统光固化复合树脂的粘结强度和脱粘界面。此外，还研究了酸蚀和水玷污的影响。将 100 个人类前磨牙随机分为 5 组，每组 20 个。选用 mini Dyna-lock 上颌前磨牙托槽进行测试。前 4 组分别用光固化 RMGIC 处理，其中 15%磷酸酸蚀处理、水玷污预处理各 20 个，对照组用常规光固化 Transbond 复合树脂在酸蚀和无玷污预处理条件下进行处理。然后，使用 Instron 机器进行拉伸力脱粘，用扫描电子显微镜对脱粘界面的托槽基底进行改良型黏结残留指数（ARI）评分。用单因素方差分析和卡方检验对粘结强度和改良 ARI 评分进行统计学分析。在所有 4 种情况下，光固化 RMGIC 的粘结强度均等于或高于传统复合树脂。经酸蚀但不玷污水的 RMGIC 粘结强度最高。 Fuji Ortho LC 的改良 ARI 评分为 2，Transbond 的改良 ARI 评分为 3。各组均未见釉质脱落。 Fuji Ortho LC 不湿润釉质用 15%磷酸酸蚀，可提供更有利的粘结强度。无论是否玷污水，无论是否酸蚀，釉质表面的粘结强度与 Transbond 相同或更高。
