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使用飞秒激光在聚合物流动芯片中制造高精度的内部三维微结构。

Using femtosecond laser to fabricate highly precise interior three-dimensional microstructures in polymeric flow chip.

出版信息

Biomicrofluidics. 2010 Oct 18;4(4):46502. doi: 10.1063/1.3504970.

Abstract

This paper reports using femtosecond laser marker to fabricate the three-dimensional interior microstructures in one closed flow channel of plastic substrate. Strip-like slots in the dimensions of 800 μm×400 μm×65 μm were ablated with pulse Ti:sapphire laser at 800 nm (pulse duration of ∼120 fs with 1 kHz repetition rate) on acrylic slide. After ablation, defocused beams were used to finish the surface of microstructures. Having finally polished with sonication, the laser fabricated structures are highly precise with the arithmetic roughness of 1.5 and 4.5 nm. Fabricating such highly precise microstructures cannot be accomplished with nanosecond laser marking or other mechanical drilling methods. In addition, since laser ablation can directly engrave interior microstructures in one closed chip, glue smearing problems to damage molded microstructures possibly to occur during the chip sealing procedures can be avoided too.

摘要

本文报告了使用飞秒激光标记在塑料基底的一个封闭流道内制造三维内部微结构。使用 800nm 的脉冲钛宝石激光(脉冲持续时间约为 120fs,重复率为 1kHz)在丙烯酸片上烧蚀尺寸为 800μm×400μm×65μm 的条状狭缝。烧蚀后,使用离焦光束完成微结构的表面处理。最后通过超声处理进行抛光,激光制造的结构具有极高的精度,算术粗糙度为 1.5nm 和 4.5nm。使用纳秒激光标记或其他机械钻孔方法无法制造如此高精度的微结构。此外,由于激光烧蚀可以直接在一个封闭的芯片内雕刻内部微结构,因此可以避免在芯片密封过程中可能出现的胶水涂抹问题,从而损坏成型的微结构。

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引用本文的文献

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