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微尺度广义热弹性圆板谐振器中的阻尼。

Damping in micro-scale generalized thermoelastic circular plate resonators.

机构信息

Department of Mathematics, National Institute of Technology, Hamirpur 177 005, India.

出版信息

Ultrasonics. 2011 Apr;51(3):352-8. doi: 10.1016/j.ultras.2010.10.009. Epub 2010 Nov 4.

Abstract

The out-of-plane vibrations of a generalized thermoelastic circular plate are studied under different environmental temperature, plate dimensions and boundary conditions. The analytical expressions for thermoelastic damping of vibration and phase velocity of circumferential surface wave modes are obtained. It is noticed that the damping of vibrations and phase velocities of circumferential surface wave modes significantly depend on thermal relaxation time in addition to thermoelastic coupling in circular plates under resonance conditions. The surface conditions also impose significant effects on the vibrations of such resonators. The expressions for displacement and temperature fields in the plate resonator are also derived and obtained. Some numerical results have also been presented for illustration purpose in case of silicon material plate.

摘要

研究了不同环境温度、板尺寸和边界条件下广义热弹性圆板的面外振动。得到了热弹性振动阻尼和周向表面波模态相速度的解析表达式。在共振条件下,除了热弹耦合外,热弛豫时间对圆形板的振动阻尼和周向表面波模态的相速度也有显著影响。表面条件也对这种谐振器的振动产生显著影响。还推导出了板谐振器中位移和温度场的表达式。还给出了硅材料板的一些数值结果。

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