AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
J Colloid Interface Sci. 2011 Jun 15;358(2):491-6. doi: 10.1016/j.jcis.2011.03.042. Epub 2011 Mar 16.
Measurement of interfacial toughness of a metal film wire and a flexible substrate is a challenging issue for evaluating the interfacial bonding capacity of the film-wire/substrate systems. In this paper, an electricity induced buckling method is proposed to measure the interfacial toughness between a metal film wire and a polymer membrane, which does not use a pre-existing weak interface. This method relies on causing a buckling driven delamination of the metal film wire from the polymer membrane, by inducing a compressive stress due to electrification of the film wire. For a sort of structure formed by a constantan film wire and a polymer membrane, the current density range under which the buckling of the film wire will emerge is obtained from experiments. The average interfacial toughness of one typical sample is measured to be 31.6 J/m(2). According to the buckling topographies under different current densities, the interfacial toughness of the constantan film wire and the polymer substrate is found to vary from 10 J/m(2) to 60 J/m(2).
测量金属膜线和柔性基底之间的界面韧性是评估膜线/基底系统界面结合能力的一个挑战。本文提出了一种利用电致屈曲法测量金属膜线与聚合物膜之间的界面韧性的方法，该方法不使用预先存在的弱界面。该方法通过使金属膜线因带电而产生压缩应力，从而导致金属膜线从聚合物膜上分层屈曲。对于由康铜膜线和聚合物膜形成的某种结构，通过实验获得了使膜线发生屈曲的电流密度范围。测量了一个典型样品的平均界面韧性，结果为 31.6 J/m(2)。根据不同电流密度下的屈曲形貌，发现康铜膜线和聚合物基底的界面韧性从 10 J/m(2)变化到 60 J/m(2)。
