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二维和三维结构的残余电阻和焦耳热释放。

Residual resistance of 2D and 3D structures and Joule heat release.

机构信息

A F Ioffe Institute of Russian Academy of Sciences, Saint Petersburg, Russia.

出版信息

J Phys Condens Matter. 2011 Jun 22;23(24):245303. doi: 10.1088/0953-8984/23/24/245303. Epub 2011 Jun 1.

DOI:10.1088/0953-8984/23/24/245303
PMID:21628783
Abstract

We consider a residual resistance and Joule heat release in 2D nanostructures as well as in ordinary 3D conductors. We assume that elastic scattering of conduction electrons by lattice defects is predominant. Within a rather intricate situation in such systems we discuss in detail two cases. (1) The elastic scattering alone (i.e. without regard of inelastic mechanisms of scattering) leads to a transition of the mechanical energy (stored by the electrons under the action of an electric field) into heat in a traditional way. This process can be described by the Boltzmann equation where it is possible to do the configuration averaging over defect positions in the electron-impurity collision term. The corresponding conditions are usually met in metals. (2) The elastic scattering can be considered with the help of the standard electron-impurity collision integral only in combination with some additional averaging procedure (possibly including inelastic scattering or some mechanisms of electron wavefunction phase destruction). This situation is typical for degenerate semiconductors with a high concentration of dopants and conduction electrons. Quite often, heat release can be observed via transfer of heat to the lattice, i.e. via inelastic processes of electron-phonon collisions and can take place at distances much larger than the size of the device. However, a direct heating of the electron system can be registered too by, for instance, local measurements of the current noise or direct measurement of an electron distribution function.

摘要

我们考虑了二维纳米结构和普通三维导体中的剩余电阻和焦耳热释放。我们假设晶格缺陷对传导电子的弹性散射占主导地位。在这种系统中相当复杂的情况下,我们详细讨论了两种情况。(1)仅考虑弹性散射(即不考虑散射的非弹性机制)会导致电子在电场作用下存储的机械能以传统方式转化为热能。这个过程可以用玻尔兹曼方程来描述,在电子-杂质碰撞项中可以对缺陷位置进行配置平均。这种情况通常在金属中存在。(2)弹性散射只能借助于标准的电子-杂质碰撞积分来考虑,而与一些附加的平均程序相结合(可能包括非弹性散射或电子波函数相位破坏的某些机制)。这种情况对于具有高掺杂浓度和传导电子的简并半导体来说是典型的。通常情况下,可以通过将热量传递到晶格(即通过电子-声子碰撞的非弹性过程)来观察到热量释放,并且这种情况可以发生在距离远大于器件尺寸的地方。然而,也可以通过例如局部测量电流噪声或直接测量电子分布函数来直接测量电子系统的加热情况。

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