Lu Hong-Liang, Chen Wei, Ding Shi-Jin, Xu Min, Zhang David Wei, Wang Li-Kang
State Key Laboratory of ASIC and System, Department of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China.
J Phys Condens Matter. 2006 Jul 5;18(26):5937-44. doi: 10.1088/0953-8984/18/26/013. Epub 2006 Jun 16.
Cluster calculations employing hybrid density functional theory have been carried out to examine the initial surface reactions in atomic layer deposition (ALD) of TiN thin films on the SiO(2) surface using TiCl(4) and NH(3) as precursors. The potential energy surface (PES) of both half-reactions at different temperatures is presented. The first half-reaction between TiCl(4) with the SiO(2) surface is activated with an activation barrier of 0.78 eV and an exothermicity of 0.38 eV, suggesting that it is thermodynamically favourable. Also, the NH(3) half-reaction begins with the formation of amido complexes by the replacement of Cl atoms by NH(2), which is endothermic by 0.58 eV with a physisorbed HCl state (HCl-PS1). Formation of the amido complexes can be followed by an elimination reaction to form imido complexes, which has a relatively high activation barrier of 2.51 eV. In addition, the effect of the reaction temperature on the Cl impurity concentrations and film growth rate in the ALD process is also discussed.
采用混合密度泛函理论进行了团簇计算,以研究在SiO(2)表面上使用TiCl(4)和NH(3)作为前驱体原子层沉积(ALD)TiN薄膜时的初始表面反应。给出了不同温度下半反应的势能面(PES)。TiCl(4)与SiO(2)表面之间的第一个半反应的活化能垒为0.78 eV,放热为0.38 eV,表明该反应在热力学上是有利的。此外,NH(3)半反应开始于通过NH(2)取代Cl原子形成酰胺配合物,该过程吸热0.58 eV,形成物理吸附的HCl态(HCl-PS1)。酰胺配合物的形成之后可能发生消除反应形成亚胺配合物,该反应具有相对较高的活化能垒2.51 eV。此外,还讨论了反应温度对ALD过程中Cl杂质浓度和薄膜生长速率的影响。