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寻常型天疱疮水疱形成中桥粒芯糖蛋白 3 的 IgG 和 IgM 抗体的致病性相关性。

Pathogenic relevance of IgG and IgM antibodies against desmoglein 3 in blister formation in pemphigus vulgaris.

机构信息

Department of Dermatology, Keio University School of Medicine, Tokyo, Japan.

出版信息

Am J Pathol. 2011 Aug;179(2):795-806. doi: 10.1016/j.ajpath.2011.04.015. Epub 2011 Jun 12.

Abstract

Pemphigus vulgaris is an autoimmune disease caused by IgG antibodies against desmoglein 3 (Dsg3). Previously, we isolated a pathogenic mAb against Dsg3, AK23 IgG, which induces a pemphigus vulgaris-like phenotype characterized by blister formation. In the present study, we generated a transgenic mouse expressing AK23 IgM to examine B-cell tolerance and the pathogenic role of IgM. Autoreactive transgenic B cells were found in the spleen and lymph nodes, whereas anti-Dsg3 AK23 IgM was detected in the cardiovascular circulation. The transgenic mice did not develop an obvious pemphigus vulgaris phenotype, however, even though an excess of AK23 IgM was passively transferred to neonatal mice. Similarly, when hybridoma cells producing AK23 IgM were inoculated into adult mice, no blistering was observed. Immunoelectron microscopy revealed IgM binding at the edges of desmosomes or interdesmosomal cell membranes, but not in the desmosome core, where AK23 IgG binding has been frequently detected. Furthermore, in an in vitro dissociation assay using cultured keratinocytes, AK23 IgG and AK23 IgM F(ab')(2) fragments, but not AK23 IgM, induced fragmentation of epidermal sheets. Together, these observations indicate that antibodies must gain access to Dsg3 integrated within desmosomes to induce the loss of keratinocyte cell-cell adhesion. These findings provide an important framework for improved understanding of B-cell tolerance and the pathophysiology of blister formation in pemphigus.

摘要

寻常型天疱疮是一种由 IgG 抗体针对桥粒芯糖蛋白 3(Dsg3)引起的自身免疫性疾病。先前,我们分离出一种针对 Dsg3 的致病性 mAb,即 AK23 IgG,它可诱导类似于寻常型天疱疮的水疱形成表型。在本研究中,我们生成了表达 AK23 IgM 的转基因小鼠,以研究 B 细胞耐受和 IgM 的致病作用。在脾脏和淋巴结中发现了自身反应性转基因 B 细胞,而心血管循环中检测到抗 Dsg3 AK23 IgM。然而,即使将过量的 AK23 IgM 被动转移给新生小鼠,转基因小鼠也未表现出明显的寻常型天疱疮表型。同样,当接种产生 AK23 IgM 的杂交瘤细胞到成年小鼠中时,也未观察到水疱形成。免疫电子显微镜显示 IgM 结合在桥粒边缘或桥粒间细胞膜上,但不在 AK23 IgG 经常检测到的桥粒核心处。此外,在使用培养角质形成细胞进行的体外解离测定中,AK23 IgG 和 AK23 IgM F(ab')(2)片段,但不是 AK23 IgM,诱导了表皮片的碎裂。综上所述,这些观察结果表明,抗体必须进入桥粒内整合的 Dsg3,才能诱导角质形成细胞细胞间黏附的丧失。这些发现为更好地理解 B 细胞耐受和天疱疮水疱形成的病理生理学提供了重要框架。

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