Oh Youngseok, Suh Daewoo, Kim Youngjin, Lee Eungsuek, Mok Jee Soo, Choi Jaeboong, Baik Seunghyun
SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 440-746, Korea.
Nanotechnology. 2008 Dec 10;19(49):495602. doi: 10.1088/0957-4484/19/49/495602. Epub 2008 Nov 19.
Carbon nanotubes (CNTs) have advantages as conductive fillers due to their large aspect ratio and excellent conductivity. In this study, a novel silver/conducting polymer composite was developed by the incorporation of silver-plated CNTs. It is important to achieve a homogeneous dispersion of nanotubes and to improve the interfacial bonding to utilize the excellent properties of reinforcements in the matrix material. The homogeneous dispersion of nanotubes was achieved by an acid treatment process, and the interfacial contact was improved by electroless silver plating around nanotubes. The resistivity of the silver/conducting polymer composite was decreased by 83% by the addition of silver-plated single-walled carbon nanotubes. Conductive bumps were also screen-printed to demonstrate the capability of the composite as electrical interconnects for multi-layer printed circuit boards.
碳纳米管(CNTs)因其大长径比和优异的导电性而作为导电填料具有优势。在本研究中,通过掺入镀银碳纳米管制备了一种新型银/导电聚合物复合材料。实现纳米管的均匀分散并改善界面结合对于在基体材料中利用增强材料的优异性能至关重要。通过酸处理工艺实现了纳米管的均匀分散,并通过在纳米管周围进行化学镀银改善了界面接触。通过添加镀银单壁碳纳米管,银/导电聚合物复合材料的电阻率降低了83%。还通过丝网印刷制备了导电凸块,以证明该复合材料作为多层印刷电路板电气互连材料的能力。