Yondem Isa, Altintas Subutay Han, Usumez Aslihan
Assist. Professor, Department of Prosthodontics, Faculty of Dentistry, Selcuk University, Konya, Turkey.
Eur J Dent. 2011 Jul;5(3):305-9.
The purpose of this study was to measure temperature increase induced by various light polymerizing units during resin composite polymerization beneath one of three types of ceramic restorations.
The resin composite (Variolink II) was polymerized between one of three different ceramic specimens (zirconium oxide, lithium disilicate, feldspathic) (diameter 5 mm, height 2 mm) and a dentin disc (diameter 5 mm, height 1 mm) with a conventional halogen light, a high intensity halogen light, or an LED unit. The temperature rise was measured under the dentin disc with a J-type thermocouple wire connected to a data logger. Ten measurements were carried out for each group. The difference between the initial and highest temperature readings was taken and the 10 calculated temperature changes were averaged to determine the mean value in temperature rise. Two way analysis of variance (ANOVA) was used to analyze the data (polymerizing unit, ceramic brand) for significant differences. The Tukey HSD test was used to perform multiple comparisons (α=.05).
Temperature rise did not vary significantly depending on the light polymerizing unit used (P=.16), however, the type of ceramic system showed a significant effect on temperature increases (P<.01). There were no statistically significant differences between lithium disilicate and feldspathic ceramic systems (P >.05); in comparison, the resin composite polymerized under the zirconium oxide ceramic system induced a significantly lower temperature increase than the other ceramic systems tested (P<.05)
The resin composite polymerized beneath zirconium oxide ceramic system induced significantly smaller temperature changes. The maximal temperature increase detected in all groups in this study was not viewed as critical for pulpal health.
本研究旨在测量在三种类型的陶瓷修复体之一下方进行树脂复合材料聚合时，各种光固化设备所引起的温度升高。
使用传统卤素灯、高强度卤素灯或发光二极管（LED）设备，在三种不同的陶瓷样本（氧化锆、二硅酸锂、长石质）（直径5毫米，高2毫米）之一与牙本质盘（直径5毫米，高1毫米）之间对树脂复合材料（Variolink II）进行聚合。通过连接到数据记录器的J型热电偶丝在牙本质盘下方测量温度升高。每组进行十次测量。记录初始温度读数与最高温度读数之间的差值，并将计算出的10个温度变化值求平均值，以确定温度升高的平均值。采用双向方差分析（ANOVA）来分析数据（光固化设备、陶瓷品牌）的显著差异。使用Tukey HSD检验进行多重比较（α = 0.05）。
温度升高并未因所使用的光固化设备而有显著差异（P = 0.16），然而，陶瓷系统的类型对温度升高有显著影响（P < 0.01）。二硅酸锂和长石质陶瓷系统之间没有统计学上的显著差异（P > 0.05）；相比之下，在氧化锆陶瓷系统下聚合的树脂复合材料所引起的温度升高明显低于其他测试的陶瓷系统（P < 0.05）。
在氧化锆陶瓷系统下方聚合的树脂复合材料引起的温度变化明显较小。本研究中所有组检测到的最大温度升高对牙髓健康而言不被视为关键因素。
