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采用不同底涂剂和黏结剂组合对 Damon3、 Damon3MX 和 APC II 托槽相对黏结强度的对比研究。

A comparative investigation into relative bond strengths of Damon3, Damon3MX, and APC II brackets using different primer and adhesive combinations.

机构信息

Department of Orthodontics, King's College London Dental Institute, London, UK.

出版信息

Eur J Orthod. 2012 Dec;34(6):778-82. doi: 10.1093/ejo/cjr112. Epub 2011 Oct 19.

Abstract

This investigation measured and compared shear bond strength (SBS) and adhesive remnant indices (ARIs) of Damon3 and Damon3MX brackets bonded with their recommended primer/adhesive combination or Transbond XT primer/adhesive, with APC II brackets bonded using Transbond XT. Sixty non-carious human third molars were collected and randomly divided into six equal groups of 10. Amongst these, one group was used to standardize the testing methodology, with the remainder constituting the five experimental groups. Upper right central incisor brackets represented each bracket type. Specifically, Damon3 brackets were bonded using either OrthoSolo primer/Blugloo (recommended) or Transbond XT primer/adhesive; Damon3MX brackets were bonded using OrthoSolo primer/Grengloo (recommended) or Transbond XT primer/adhesive, and APC II brackets were bonded with Transbond XT primer. Brackets were debonded by shear force using an Instron machine and the SBS measured. Scores for ARI were determined for all groups after bracket failure by magnified inspection of the tooth surface. Logrank tests showed a significantly higher SBS with Damon3 brackets bonded with OrthoSolo/Blugloo compared with Transbond XT, but no significant differences between the SBS of Damon3MX brackets bonded with OrthoSolo/Grengloo compared with Transbond XT. There were no significant differences in SBS of all three bracket types when bonded with Transbond XT. Pearson's chi-square test showed no difference in the locus of debond. All three adhesive systems are reliable when bonding Damon3 and Damon3MX brackets. Some caution should be taken when using Damon3 brackets bonded with OrthoSolo/Blugloo due to the higher SBS, although no enamel fractures were noted in this study.

摘要

本研究旨在测量并比较 Damon3 和 Damon3MX 托槽在使用推荐的底胶/黏结剂(Ortho Solo/Blugloo)组合或 Transbond XT 底胶/黏结剂与 Transbond XT 黏结 APC II 托槽时的剪切粘结强度(SBS)和残留粘结指数(ARI)。研究共收集了 60 颗非龋性第三磨牙并随机分为 10 个相等的组,其中一组用于标准化测试方法,其余 9 组为实验组。上颌右侧中切牙代表各托槽类型。具体来说,Damon3 托槽使用 OrthoSolo 底胶/Blugloo(推荐)或 Transbond XT 底胶/黏结剂黏结;Damon3MX 托槽使用 OrthoSolo 底胶/Grengloo(推荐)或 Transbond XT 底胶/黏结剂黏结,而 APC II 托槽则使用 Transbond XT 底胶黏结。使用 Instron 机器通过剪切力使托槽脱粘,并测量 SBS。在托槽脱落后,通过放大检查牙面确定所有组的 ARI 评分。对数秩检验显示,使用 OrthoSolo/Blugloo 黏结 Damon3 托槽的 SBS 显著高于 Transbond XT,但使用 OrthoSolo/Grengloo 黏结 Damon3MX 托槽的 SBS 与 Transbond XT 无显著差异。使用 Transbond XT 黏结时,三种托槽类型的 SBS 无显著差异。Pearson's chi-square 检验显示,脱粘部位无差异。使用 Damon3 和 Damon3MX 托槽时,三种黏结系统均可靠。由于 SBS 较高,使用 OrthoSolo/Blugloo 黏结 Damon3 托槽时应谨慎,尽管本研究未发现牙釉质裂。

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