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氧化铝喷砂处理钛表面的铜离子和银离子植入:成骨细胞的增殖反应及抗菌作用

Copper and silver ion implantation of aluminium oxide-blasted titanium surfaces: proliferative response of osteoblasts and antibacterial effects.

作者信息

Fiedler Jörg, Kolitsch Andreas, Kleffner Bernhard, Henke Dietmar, Stenger Steffen, Brenner Rolf E

机构信息

Department of Orthopedics, Division for Biochemistry of Joint and Connective Tissue Diseases, University of Ulm, Ulm, Germany.

出版信息

Int J Artif Organs. 2011 Sep;34(9):882-8. doi: 10.5301/ijao.5000022.

DOI:10.5301/ijao.5000022
PMID:22094570
Abstract

Implant infection still represents a major clinical problem in orthopedic surgery. We therefore tested the in vitro biocompatibility and antibacterial effects of copper (Cu)- and silver (Ag)-ion implantation. Discs of a commonly used titanium alloy (Ti6AlV4) with an aluminium oxide-blasted surface were treated by Cu- or Ag-ion implantation with different dosage regimen (ranging from 1e15-17 ions cm(-2) at energies of 2-20 keV). The samples were seeded with primary human osteoblasts and cell attachment and proliferation was analyzed by an MTT-assay. In comparison to the reference titanium alloy there was no difference in the number of attached viable cells after two days. After seven days the number of viable cells was increased for Cu with 1e17 ions cm(-2) at 2 and 5 keV, and for Ag with 1e16 ions cm(-2) at 5 keV while it was reduced for the highest amount of Ag deposition (1e17 ions cm(-2) at 20 keV). Antibacterial effects on S.aureus and E.coli were marginal for the studied dosages of Cu but clearly present for Ag with 1e16 ions cm(-2) at 2 and 5 keV and 1e17 ions cm(-2) at 20 keV. These results indicate that Ag-ion implantation may be a promising methodological approach for antibacterial functionalization of titanium implants.

摘要

植入物感染仍是骨科手术中的一个主要临床问题。因此,我们测试了铜(Cu)离子和银(Ag)离子植入的体外生物相容性和抗菌效果。对具有氧化铝喷砂表面的常用钛合金(Ti6AlV4)圆盘进行不同剂量方案(能量为2 - 20 keV时,离子剂量范围为1×10¹⁵ - ¹⁷离子/cm²)的Cu离子或Ag离子植入处理。将样品接种原代人成骨细胞,并通过MTT法分析细胞附着和增殖情况。与参考钛合金相比,两天后附着的活细胞数量没有差异。七天后,能量为2 keV和5 keV、离子剂量为1×10¹⁷离子/cm²的Cu处理组以及能量为5 keV、离子剂量为1×10¹⁶离子/cm²的Ag处理组活细胞数量增加,而Ag沉积量最高(能量为20 keV、离子剂量为1×10¹⁷离子/cm²)的处理组活细胞数量减少。对于所研究的Cu剂量,对金黄色葡萄球菌和大肠杆菌的抗菌作用不明显,但对于能量为2 keV和5 keV、离子剂量为1×10¹⁶离子/cm²以及能量为20 keV、离子剂量为1×10¹⁷离子/cm²的Ag处理组,抗菌作用明显。这些结果表明,Ag离子植入可能是一种有前景的钛植入物抗菌功能化方法。

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