Research and Development Department, Swing Corporation, 4-2-1 Honfujisawa, Fujisawa-shi, Kanagawa 251-8502, Japan.
Water Sci Technol. 2011;64(2):416-22. doi: 10.2166/wst.2011.577.
For on-site copper recovery in print circuit board factories, we propose a novel technology to obtain cupric oxide with a low content ratio of chloride from high chloride concentration waste, such as cupric chloride etchant waste. Our technology is designed to avoid formation of double salt and accumulation of cupric hydroxide. In the proposed method, etchant waste mixed with hydrogen peroxide solution is added to sodium hydroxide solution by stepwise addition. We performed lab-scale experiments on the influence of reaction pH conditions on the content ratio of chloride in recovering cupric oxide. The results show that recycled cupric oxide tends to contain a lower content ratio of chloride under higher starting temperatures and higher final pH conditions of the reaction. We also confirmed the optimized conditions; the starting temperature of the sodium hydroxide solution is higher than 70 degrees C, and the final pH of the reaction is 11.5 to 12. Based on the optimized temperature and pH conditions, we also performed a pilot trial to recover cupric oxide from real etchant waste. Then, we successfully obtained cupric oxide with a content ratio of chloride in 80 mg-Cl/kg-CuO.
对于印刷电路板工厂的现场铜回收,我们提出了一种从高氯浓度废物(如氯化铜蚀刻剂废物)中获得低氯含量氧化铜的新技术。我们的技术旨在避免形成复盐和氢氧化铜的积累。在提出的方法中,将蚀刻剂废物与过氧化氢溶液混合,通过分步添加到氢氧化钠溶液中。我们进行了实验室规模的实验,研究了反应 pH 值条件对回收氧化铜中氯含量比的影响。结果表明,在较高的起始温度和较高的最终反应 pH 值条件下,回收的氧化铜往往含有较低的氯含量比。我们还确认了优化条件;氢氧化钠溶液的起始温度高于 70°C,反应的最终 pH 值为 11.5 至 12。基于优化的温度和 pH 值条件,我们还进行了从实际蚀刻剂废物中回收氧化铜的中试试验。然后,我们成功地获得了氯含量比为 80mg-Cl/kg-CuO 的氧化铜。