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通过电子束蒸发制备的Sb2Te3薄膜的热电性能

Thermoelectric properties of Sb2Te3 thin films by electron beam evaporation.

作者信息

Chang Ho, Kao Mu-Jung, Peng Cheng-Hao, Kuo Chin-Guo, Huang Kuohsiu-David

机构信息

Department of Mechanical Engineering, National Taipei University of Technology, Taipei 10608, Taiwan.

出版信息

J Nanosci Nanotechnol. 2011 Aug;11(8):7491-4. doi: 10.1166/jnn.2011.4814.

Abstract

This study applies the thermoelectric grains of Sb2Te3 on conductive glass to evaporate Sb2Te3 thin films by the electron beam evaporation method. Through experimental tests with different evaporation process parameters and film annealing conditions, thin films with better Seebeck coefficient, resistivity (p) and power fact (PF) can be obtained. Experimental results show that when thin films are annealed, their defects can be decreased accordingly, and carrier mobility can be enhanced to further elevate the conductivity of thin films. When the substrate temperature is set at 200 degrees C to fabricate Sb2Te3 thin films by the evaporation process and by annealing at 220 degrees C for 60 minutes, the Seebeck coefficient of Sb2Te3 thin films increase from 87.6 microV/K to 177.7 microV/K; resistivity falls from 6.21 m ohms-cm to 2.53 m ohms-cm and PF can achieve the maximum value of 1.24 10(-3) W/K2 m. Finally, this study attempts to add indium (In) to Sb2Te3 thin films. Indium has been successfully fabricated In3SbTe, thin films. This study also analyzes the effects of In on the thermoelectric properties of In3SbTe2 thin films.

摘要

本研究将Sb2Te3的热电颗粒应用于导电玻璃上,通过电子束蒸发法蒸发Sb2Te3薄膜。通过不同蒸发工艺参数和薄膜退火条件的实验测试,可以获得具有更好塞贝克系数、电阻率(p)和功率因子(PF)的薄膜。实验结果表明,薄膜退火时,其缺陷会相应减少,载流子迁移率会提高,从而进一步提高薄膜的导电性。当通过蒸发工艺在200℃的基板温度下制备Sb2Te3薄膜,并在220℃下退火60分钟时,Sb2Te3薄膜的塞贝克系数从87.6 μV/K增加到177.7 μV/K;电阻率从6.21 mΩ·cm降至2.53 mΩ·cm,PF可达到1.24×10(-3) W/K2 m的最大值。最后,本研究尝试在Sb2Te3薄膜中添加铟(In)。已成功制备出In3SbTe2薄膜。本研究还分析了In对In3SbTe2薄膜热电性能的影响。

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