Nano Tech Center and Department of Electrical and Computer Engineering, Texas Tech University, Lubbock, TX 79409, USA.
J Phys Condens Matter. 2012 Jan 25;24(3):035601. doi: 10.1088/0953-8984/24/3/035601. Epub 2011 Dec 19.
We report the evolution process of VO(2) thin films from the insulating phase to the metallic phase under current injection for the two-electrode-based thin-film devices. Based on electrical characterization and Raman microscopic detection, it was found that there exist two critical current densities, based on which the insulator-to-metal transition process can be divided into three stages. In stage I with low current injection, the VO(2) film in the insulating (semiconducting) phase acts as a resistor until the first critical current density, above which the insulator-metal transition is a percolation process with metallic rutile and insulating monoclinic phases coexisting (stage II); while beyond a second critical current density, a filamentary current path with pure metallic phase is formed with the remaining part outside of the current path receding back to the pure insulating phase (stage III). We confirm that a critical current density is required for the onset of electrically induced insulator-to-metal transition in VO(2) thin films.
我们报告了基于两电极的薄膜器件中,在电流注入下 VO(2) 薄膜从绝缘相到金属相的演化过程。基于电特性和拉曼微观检测,发现存在两个临界电流密度,基于此,可以将绝缘-金属转变过程分为三个阶段。在低电流注入的第一阶段,处于绝缘(半导体)相的 VO(2) 薄膜充当电阻,直到达到第一个临界电流密度,超过该电流密度后,绝缘-金属转变是一个渗流过程,同时存在金红石型金属相和单斜型绝缘相(第二阶段);而超过第二个临界电流密度后,形成具有纯金属相的丝状电流路径,电流路径以外的其余部分退回到纯绝缘相(第三阶段)。我们证实,在 VO(2) 薄膜中,电诱导的绝缘-金属转变需要一个临界电流密度。