Kim Kwang-Seok, Kim Yongil, Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, 440-746, Republic of Korea.
Nanoscale Res Lett. 2012 Jan 5;7(1):49. doi: 10.1186/1556-276X-7-49.
The microstructural evolution and the adhesion of an Ag nanopaste screen-printed on a silicon substrate were investigated as a function of sintering temperature. Through the two thermal analysis methods, such as differential scanning calorimeter and thermo-gravimetric analysis, the sintering conditions were defined where the temperature was raised from 150°C to 300°C, all with a fixed sintering time of 30 min. The microstructure and the volume of the printed Ag nanopaste were observed using a field emission scanning electron microscope and a 3-D surface profiler, respectively. The apparent density of the printed Ag nanopaste was calculated depending on the sintering conditions, and the adhesion was evaluated by a scratch test. As the sintering temperature increased from 150°C to 300°C, the apparent density and the adhesion increased by 22.7% and 43%, respectively. It is confirmed that the printed Ag nanopaste sintered at higher temperatures showed higher apparent density in the microstructural evolution and void aggregation, resulting in the lower electrical resistivity and various scratched fractures.
研究了丝网印刷在硅衬底上的银纳米浆料的微观结构演变及其附着力与烧结温度的关系。通过差示扫描量热仪和热重分析这两种热分析方法，确定了烧结条件，即温度从150°C升至300°C，烧结时间均固定为30分钟。分别用场发射扫描电子显微镜和三维表面轮廓仪观察了印刷银纳米浆料的微观结构和体积。根据烧结条件计算了印刷银纳米浆料的表观密度，并通过划痕试验评估了附着力。随着烧结温度从150°C升高到300°C，表观密度和附着力分别增加了22.7%和43%。证实了在较高温度下烧结的印刷银纳米浆料在微观结构演变和孔隙聚集方面表现出更高的表观密度，从而导致更低的电阻率和各种划痕断裂。
