Kim Kwang-Seok, Ahn Jee-Hyuk, Noh Bo-In, Jung Seung-Boo
SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, 300 Cheoncheon-Dong, Jangan-Gu, Suwon 440-746, Republic of Korea.
J Nanosci Nanotechnol. 2012 Apr;12(4):3219-23. doi: 10.1166/jnn.2012.5645.
We evaluated the electrical reliability of screen-printed silver (Ag) patterns sintered at various temperatures under variable bias voltages. Comb-type patterns were screen-printed onto a flame resistance-4 substrate using a commercial Ag nanopaste (24 nm in diameter, 73 wt% of Ag nanoparticles). The printed patterns were then sintered for 30 min in air at various temperatures ranging from 100 degrees C to 200 degrees C. The microstructures and thickness profiles of the sintered conductive patterns were identified with a field emission scanning electron microscope and a 3-D surface profiler, respectively. In this study, the phenomenon of electrochemical migration was investigated with a water drop test with deionized water. These results showed that the time required by dendrites to bridge from a cathode to an anode was affected by the sintering temperature and applied voltage; when the sintering temperature was 200 degrees C, the time to achieve a short circuit was nearly four times that of the sample sintered at 100 degrees C, and while the applied voltage increased from 3 V to 9 V, the time to reach a short circuit decreased, on average, by 11%.
我们评估了在可变偏置电压下于不同温度烧结的丝网印刷银（Ag）图案的电气可靠性。使用市售的银纳米糊剂（直径24 nm，银纳米颗粒含量73 wt%）将梳状图案丝网印刷到阻燃4基板上。然后将印刷图案在空气中于100℃至200℃的不同温度下烧结30分钟。分别用场发射扫描电子显微镜和三维表面轮廓仪来识别烧结导电图案的微观结构和厚度轮廓。在本研究中，通过用去离子水进行水滴试验来研究电化学迁移现象。这些结果表明，树枝状晶体从阴极桥接至阳极所需的时间受烧结温度和施加电压的影响；当烧结温度为200℃时，达到短路的时间几乎是在100℃烧结的样品的四倍，并且当施加电压从3 V增加到9 V时，达到短路的时间平均减少了11%。
