金焊料与金合金的界面。

The gold solder, gold alloy interface.

作者信息

Rogers O W

出版信息

Aust Dent J. 1977 Jun;22(3):168-71. doi: 10.1111/j.1834-7819.1977.tb04483.x.

DOI:10.1111/j.1834-7819.1977.tb04483.x

Abstract

With soldering the physical properties of the basis metal must be maintained and a minimum of molten metal is used. An examination of joints in 17 gauge platinized gold wire is made with 18 k gold solder following quenching immediately after flow and cooling in air; there is a widening of grain boundaries and intergranulation penetration in the latter method. A comparison with the cast gold joint is made. Some inclusions were noted.

摘要

在焊接时，必须保持基体金属的物理性能，并尽量少用熔融金属。对17号规格的镀铂金丝接头进行检查，在其流动后立即淬火并在空气中冷却，然后用18k金焊料焊接；后一种方法会出现晶界变宽和晶间渗透现象。并与铸造金接头进行了比较。发现了一些夹杂物。