Shen C L, Kuo P C, Li Y S, Lin G P, Huang K T, Ou S L, Chen S C
Institute of Materials Science and Engineering, National Taiwan University, Taipei 10617, Taiwan.
J Nanosci Nanotechnol. 2011 Dec;11(12):11171-5. doi: 10.1166/jnn.2011.4044.
CoPt/Ag films were prepared by magnetron sputtering on glass substrates and subsequent annealing. The dependence of degree of ordering and magnetic properties on Ag film thickness and annealing conditions were investigated. It was found that the Ag underlayer played a dominant role in inducing the (001) texture of the CoPt film after annealing. CoPt films with a thickness about 20 nm and Ag underlayers with a thickness about 70 nm are easy to obtain a large degree of ordering and a perpendicular magnetic anisotropy after annealing at 700 degrees C for 30 min. CoPt/Ag films with out-of-plane coercivity (Hc (perpendicular)) in the range of 13.5-14.0 kOe and a out-of-plane squareness (S(perpendicular)) of 0.97 were obtained after annealing at 700 degrees C for 30 min. Ag underlayer is beneficial to enhance the Hc(perpendicular)and S(perpendicular) of CoPt film significantly. The degree of ordering and perpendicular magnetic properties of the CoPt films which deposited on Ag underlayer are larger than those of the single layer CoPt films.
通过磁控溅射在玻璃基板上制备CoPt/Ag薄膜并随后进行退火处理。研究了有序度和磁性能对Ag薄膜厚度和退火条件的依赖性。结果发现，Ag底层在退火后诱导CoPt薄膜的(001)织构方面起主导作用。厚度约为20 nm的CoPt薄膜和厚度约为70 nm的Ag底层在700℃退火30分钟后易于获得较大的有序度和垂直磁各向异性。在700℃退火30分钟后，获得了面外矫顽力（Hc(垂直)）在13.5 - 14.0 kOe范围内且面外矩形比（S(垂直)）为0.97的CoPt/Ag薄膜。Ag底层有利于显著提高CoPt薄膜的Hc(垂直)和S(垂直)。沉积在Ag底层上的CoPt薄膜的有序度和垂直磁性能大于单层CoPt薄膜。
