Gould Michael, Baehr-Jones Tom, Ding Ran, Hochberg Michael
Department of Electrical Engineering, University of Washington, Campus Box 352500, Seattle, Washington 98195, USA.
Opt Express. 2012 Mar 26;20(7):7101-11. doi: 10.1364/OE.20.007101.
Silicon has recently attracted a great deal of interest as an economical platform for integrated photonics systems. Integrated photodetectors are a key component of such systems, and CMOS-compatible processes involving epitaxially grown germanium for photodetection have been demonstrated. Detector parasitic capacitance is a key limitation, which will likely worsen if techniques such as bump bonding are employed. Here we propose leveraging the complexity available in silicon photonics processes to compensate for this using a technique known as gain peaking. We predict that by simply including an inductor and capacitor in the photodetector circuit with the properly chosen values, detector bandwidths can be as much as doubled, with no undesired effects.
作为集成光子系统的经济平台,硅最近引起了极大的关注。集成光电探测器是此类系统的关键组件,并且已经展示了涉及外延生长锗用于光探测的与CMOS兼容的工艺。探测器寄生电容是一个关键限制,如果采用诸如凸点键合等技术,这一限制可能会加剧。在此,我们提出利用硅光子工艺中可用的复杂性,通过一种称为增益峰值的技术来对此进行补偿。我们预测,只需在光电探测器电路中包含一个电感和一个电容,并选择合适的值,探测器带宽就可以增加一倍之多,且不会产生不良影响。