Department of Mechanical Science and Engineering, Nagoya University, Nagoya 464-8603, Japan.
Nanotechnology. 2012 Sep 14;23(36):365202. doi: 10.1088/0957-4484/23/36/365202. Epub 2012 Aug 21.
Mass production of surface mount devices (SMDs) relies heavily on reflow soldering and has become the cornerstone of today's electronic industry. However, the traditional reflow soldering technique is characterized by high heating temperatures, toxic solder materials and low recycling rate of SMDs. Here, we propose a new patterned structure of Au nanowire arrays named a surface fastener through which cold bonding for surface mount technology can be realized. The mechanical bonding enables normal and shear bonding strengths of more than 5 N cm(-2). Simultaneously, the parasitic resistance of a pair of surface fasteners is only approximately 2 Ω. The present technique can be performed at room temperature, thereby improving the process compatibility and reliability of SMDs. Surface fasteners based on high melting point metallic nanowires are temperature-resistant for many critical applications. In addition, bonding without solder material is positive for the recycling of rare metals in SMDs.
表面贴装器件 (SMD) 的大规模生产主要依赖于回流焊接，已成为当今电子行业的基石。然而，传统的回流焊接技术具有加热温度高、焊料材料有毒以及 SMD 回收利用率低等特点。在这里，我们提出了一种新型的 Au 纳米线阵列图案结构，名为表面紧固件，通过它可以实现表面贴装技术的冷键合。机械键合使 SMD 的正常和剪切键合强度超过 5 N cm(-2)。同时，一对表面紧固件的寄生电阻仅约为 2 Ω。本技术可在室温下进行，从而提高 SMD 的工艺兼容性和可靠性。基于高熔点金属纳米线的表面紧固件可耐受许多关键应用的高温。此外，无需焊料材料进行键合有利于 SMD 中稀有金属的回收。
