Toku Yuhki, Ichioka Kazuma, Morita Yasuyuki, Ju Yang
Department of Micro-Nano Mechanical Science and Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, Aichi, 464-8603, Japan.
Sci Rep. 2019 Jan 31;9(1):1095. doi: 10.1038/s41598-018-37693-2.
Surface-mount techniques primarily depend on soldering. However, soldering techniques have encountered some challenges in recent years. These challenges include rare metal recycling, thermal problems, and Pb toxicity. We recently developed a metallic nanowire surface fastener (NSF) to resolve the abovementioned problems. This fastener can be used to connect electronic components on a substrate at room temperature using the van der Waals force between each nanowire. This study demonstrates a 64-pin NSF that behaves like a ball grid array (BGA) for application to actual electronic devices. The adhesion strength and electrical properties of the NSF were investigated by adjusting the nanowire parameters, such as diameter, length, density (number per area), preload, and shape. The shape control of the nanowires greatly contributed to the improvement of the properties. A maximum adhesion strength of 16.4 N/cm was achieved using a bent, hook-like NSF. This strength was 4-5 times the value of the straight NSF. The contact resistivity was 2.98 × 10 Ω∙cm. The NSF fabricated through the simple template method showed the room temperature bonding ability and adaptability to a highly ordered electrode like the BGA.
表面贴装技术主要依赖于焊接。然而，近年来焊接技术遇到了一些挑战。这些挑战包括稀有金属回收、热问题和铅毒性。我们最近开发了一种金属纳米线表面紧固件（NSF）来解决上述问题。这种紧固件可利用每根纳米线之间的范德华力在室温下用于连接基板上的电子元件。本研究展示了一种64引脚的NSF，其表现类似于球栅阵列（BGA），可应用于实际电子设备。通过调整纳米线参数，如直径、长度、密度（每单位面积的数量）、预载和形状，对NSF的粘附强度和电学性能进行了研究。纳米线的形状控制对性能的提升有很大贡献。使用弯曲的钩状NSF实现了16.4 N/cm的最大粘附强度。该强度是直的NSF的4至5倍。接触电阻率为2.98×10Ω∙cm。通过简单模板法制造的NSF表现出室温键合能力以及对像BGA这样高度有序电极的适应性。
