Service of Infectious Diseases, University Hospital Center Lausanne (CHUV), Lausanne, Switzerland.
Appl Environ Microbiol. 2012 Dec;78(23):8176-82. doi: 10.1128/AEM.02266-12. Epub 2012 Sep 14.
Bacteria can survive on hospital textiles and surfaces, from which they can be disseminated, representing a source of health care-associated infections (HCAIs). Surfaces containing copper (Cu), which is known for its bactericidal properties, could be an efficient way to lower the burden of potential pathogens. The antimicrobial activity of Cu-sputtered polyester surfaces, obtained by direct-current magnetron sputtering (DCMS), against methicillin-resistant Staphylococcus aureus (MRSA) was tested. The Cu-polyester microstructure was characterized by high-resolution transmission electron microscopy to determine the microstructure of the Cu nanoparticles and by profilometry to assess the thickness of the layers. Sputtering at 300 mA for 160 s led to a Cu film thickness of 20 nm (100 Cu layers) containing 0.209% (wt/wt) polyester. The viability of MRSA strain ATCC 43300 on Cu-sputtered polyester was evaluated by four methods: (i) mechanical detachment, (ii) microcalorimetry, (iii) direct transfer onto plates, and (iv) stereomicroscopy. The low efficacy of mechanical detachment impeded bacterial viability estimations. Microcalorimetry provided only semiquantitative results. Direct transfer onto plates and stereomicroscopy seemed to be the most suitable methods to evaluate the bacterial inactivation potential of Cu-sputtered polyester surfaces, since they presented the least experimental bias. Cu-polyester samples sputtered for 160 s by DCMS were further tested against 10 clinical MRSA isolates and showed a high level of bactericidal activity, with a 4-log(10) reduction in the initial MRSA load (10(6) CFU) within 1 h. Cu-sputtered polyester surfaces might be of use to prevent the transmission of HCAI pathogens.
细菌可以在医院的纺织品和表面存活,并由此传播,成为导致医源性感染(HAI)的源头。含有铜(Cu)的表面具有杀菌特性,是降低潜在病原体负担的有效方法。本研究通过直流磁控溅射(DCMS)获得镀铜聚酯表面,测试了其对耐甲氧西林金黄色葡萄球菌(MRSA)的抗菌活性。采用高分辨率透射电子显微镜(TEM)对 Cu-聚酯微观结构进行了特征描述,以确定 Cu 纳米颗粒的微观结构;采用轮廓仪评估了薄膜的厚度。300 mA 溅射 160 s 后,Cu 薄膜厚度为 20nm(100 层 Cu),聚酯中 Cu 含量为 0.209%(wt/wt)。采用四种方法评估了 MRSA 菌株 ATCC 43300 在镀铜聚酯上的存活情况:(i)机械分离,(ii)微量热法,(iii)直接平板转移,(iv)体视显微镜观察。机械分离效率低下,阻碍了对细菌活力的评估。微量热法仅提供半定量结果。直接平板转移和体视显微镜观察似乎是评估镀铜聚酯表面细菌灭活潜力的最合适方法,因为它们的实验偏差最小。通过 DCMS 溅射 160s 的 Cu-聚酯样品进一步对 10 株临床分离的 MRSA 进行了测试,结果显示出很高的杀菌活性,在 1 小时内,初始 MRSA 负荷(10^6 CFU)减少了 4 个对数(10^4)。镀铜聚酯表面可能有助于防止 HAI 病原体的传播。