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桥粒黏附与寻常型天疱疮:故事的前半部分

Desmosomal adhesion and pemphigus vulgaris: the first half of the story.

作者信息

Cirillo Nicola, Al-Jandan Badr A

机构信息

Melbourne Dental School, The University of Melbourne, Melbourne, Victoria 3053, Australia.

出版信息

Cell Commun Adhes. 2013 Feb;20(1-2):1-10. doi: 10.3109/15419061.2013.763799. Epub 2013 Feb 1.

DOI:10.3109/15419061.2013.763799
PMID:23368972
Abstract

Pemphigus vulgaris (PV) is a paradigm of autoimmune disease affecting intercellular adhesion. The mechanisms that lead to cell-cell detachment (acantholysis) have crucial therapeutic implications and are currently undergoing major scrutiny. The first part of this review focuses on the classical view of the pathogenesis of PV, which is dominated by the cell adhesion molecules of the desmosome, namely desmogleins (Dsgs). Cloning of the DSG3 gene, generation DSG3 knock-out mice and isolation of monoclonal anti-Dsg3 IgG have aided to clarify the pathogenic mechanisms of PV, which are in part dependent on the fate of desmosomal molecules. These include perturbation of the desmosomal network at the transcriptional, translational, and interaction level, kinase activation, proteinase-mediated degradation, and hyper-adhesion. By the use of PV models, translational research has in turn helped shed light into the basic structure, function, and dynamics of assembly of desmosomal cadherins. The combined efforts of basic and applied research has resulted in tremendous advance into the understanding of epidermal adhesion and helped debunk old myths on the supposedly unique role of desmogleins in the mechanisms of cell-cell detachment in PV.

摘要

寻常型天疱疮(PV)是一种影响细胞间黏附的自身免疫性疾病的范例。导致细胞间分离(棘层松解)的机制具有关键的治疗意义,目前正在接受严格审查。本综述的第一部分重点关注PV发病机制的经典观点,该观点主要由桥粒的细胞黏附分子,即桥粒芯糖蛋白(Dsgs)主导。DSG3基因的克隆、DSG3基因敲除小鼠的产生以及抗Dsg3单克隆IgG的分离有助于阐明PV的致病机制,这些机制部分取决于桥粒分子的命运。这些包括在转录、翻译和相互作用水平上桥粒网络的扰动、激酶激活、蛋白酶介导的降解以及过度黏附。通过使用PV模型,转化研究反过来又有助于阐明桥粒钙黏蛋白的基本结构、功能和组装动力学。基础研究和应用研究的共同努力极大地推动了对表皮黏附的理解,并有助于破除关于桥粒芯糖蛋白在PV细胞间分离机制中具有独特作用的旧有观念。

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Desmosomal adhesion and pemphigus vulgaris: the first half of the story.桥粒黏附与寻常型天疱疮:故事的前半部分
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Subcellular localization of desmosomal components is different between desmoglein3 knockout mice and pemphigus vulgaris model mice.桥粒芯糖蛋白3基因敲除小鼠与寻常型天疱疮模型小鼠的桥粒成分亚细胞定位不同。
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IgG binds to desmoglein 3 in desmosomes and causes a desmosomal split without keratin retraction in a pemphigus mouse model.在天疱疮小鼠模型中,IgG与桥粒中的桥粒芯糖蛋白3结合,导致桥粒分裂,而角蛋白不回缩。
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Ultrastructural changes in mice actively producing antibodies to desmoglein 3 parallel those in patients with pemphigus vulgaris.积极产生抗桥粒芯糖蛋白3抗体的小鼠的超微结构变化与寻常型天疱疮患者的超微结构变化相似。
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Immunoadsorption of Desmoglein-3-Specific IgG Abolishes the Blister-Inducing Capacity of Pemphigus Vulgaris IgG in Neonatal Mice.免疫吸附法去除寻常型天疱疮 IgG 中的桥粒芯糖蛋白 3 特异性 IgG 可消除其在新生小鼠中的水疱诱导能力。
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Binding of pemphigus vulgaris IgG to antigens in desmosome core domains excludes immune complexes rather than directly splitting desmosomes.寻常型天疱疮 IgG 与桥粒核心域抗原的结合排除了免疫复合物,而不是直接分裂桥粒。
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Serum from pemphigus vulgaris reduces desmoglein 3 half-life and perturbs its de novo assembly to desmosomal sites in cultured keratinocytes.寻常型天疱疮患者的血清可降低桥粒芯糖蛋白3的半衰期,并干扰其在培养的角质形成细胞中从头组装到桥粒部位的过程。
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Antibodies against keratinocyte antigens other than desmogleins 1 and 3 can induce pemphigus vulgaris-like lesions.针对除桥粒芯糖蛋白1和3之外的角质形成细胞抗原的抗体可诱发寻常型天疱疮样皮损。
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High-dose pemphigus antibodies against linear epitopes of desmoglein 3 (Dsg3) can induce acantholysis and depletion of Dsg3 from keratinocytes.针对桥粒芯糖蛋白3(Dsg3)线性表位的高剂量天疱疮抗体可诱导棘层松解和桥粒芯糖蛋白3从角质形成细胞中耗竭。
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