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A package design technique for size reduction of implantable bioelectronic systems.

作者信息

Soma M

机构信息

Department of Electrical Engineering, University of Washington, Seattle 98195.

出版信息

IEEE Trans Biomed Eng. 1990 May;37(5):482-8. doi: 10.1109/10.55650.

DOI:10.1109/10.55650
PMID:2345004
Abstract

This paper presents several substrate and package design techniques to minimize the overall size of bioelectronic systems, especially those that will be implanted for in vivo studies. The emphasis is on a new capacitor attachment and a new double-substrate design that have been successfully applied to the packaging of an implantable auditory prosthesis. The entire procedure for this case is described and compared with standard techniques to illustrate the advantages of this new approach in packaging.

摘要

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