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6.4nm 厚金薄膜的热与电传导

Thermal and electrical conduction in 6.4 nm thin gold films.

机构信息

Department of Mechanical Engineering, Iowa State University, 2010 Black Engineering Building, Ames, Iowa 50011, USA.

出版信息

Nanoscale. 2013 Jun 7;5(11):4652-6. doi: 10.1039/c3nr00729d. Epub 2013 Apr 22.

Abstract

For sub-10 nm thin metallic films, very little knowledge is available so far on how electron scattering at surface and grain boundaries reduces the thermal transport. This work reports on the first time characterization of the thermal and electrical conductivities of gold films of 6.4 nm average thickness. The electrical (σ) and thermal (k) conductivities of the Au film are found to be reduced dramatically from their bulk counterparts by 93.7% (σ) and 80.5% (k). Its Lorenz number is measured as 7.44 × 10(-8) W Ω K(-2), almost a twofold increase from the bulk value. The Mayadas-Shatzkes model is used to interpret the experimental results and reveals very strong electron reflection (77%) at grain boundaries.

摘要

对于厚度小于 10nm 的薄金属膜,目前对于表面和晶界处的电子散射如何降低热传输还知之甚少。本工作首次对平均厚度为 6.4nm 的金膜的热导率和电导率进行了表征。实验发现,金膜的电导率(σ)和热导率(k)分别比块体材料降低了 93.7%(σ)和 80.5%(k)。其洛伦兹数测量值为 7.44×10^(-8) W Ω K^(-2),几乎是块体值的两倍。采用 Mayadas-Shatzkes 模型对实验结果进行解释,结果表明晶界处电子反射非常强烈(77%)。

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