Jana S, Mondal S, Bhattacharyya S R
Surface Physics Division, Saha Institute of Nuclear Physics, 1/AF Bidhan Nagar, Kolkata 700064, India.
J Nanosci Nanotechnol. 2013 Jun;13(6):3983-9. doi: 10.1166/jnn.2013.7210.
The vertically aligned silicon nanowires (SiNWs) have been synthesized by metal assisted chemical etching process on commercially available p type silicon wafer. The aspect ratios of the SiNWs have been modified by simply varying the etching time. The microstructures of the as prepared samples have been investigated with the field emission scanning electron microscope as well as with a high resolution transmission electron microscope. The bonding information has been obtained by Fourier transformed infrared spectroscopy and X-ray photoelectron spectroscopy. The contact angles for water with the as-prepared SiNWs films were measured and found to be highly dependent upon the aspect ratio of the as synthesized wires. For obtaining a deep insight regarding the reasons behind this dependence the surface energies of the as prepared SiNWs films have been calculated by Owens method using two liquids, water and glycerol. The porosity of the films has been calculated indirectly from the equilibrium equations. It has been found that the etching time has a profound effect on the aspect ratio and thus on the surface energy of SiNWs that governs the wetting behaviour of the as prepared samples.
通过金属辅助化学蚀刻工艺,在市售的p型硅片上合成了垂直排列的硅纳米线(SiNWs)。通过简单地改变蚀刻时间来改变SiNWs的纵横比。利用场发射扫描电子显微镜和高分辨率透射电子显微镜对制备好的样品的微观结构进行了研究。通过傅里叶变换红外光谱和X射线光电子能谱获得了键合信息。测量了制备好的SiNWs薄膜与水的接触角,发现其高度依赖于合成线的纵横比。为了深入了解这种依赖性背后的原因,使用水和甘油两种液体,通过欧文斯方法计算了制备好的SiNWs薄膜的表面能。薄膜的孔隙率已根据平衡方程间接计算得出。已经发现蚀刻时间对纵横比有深远影响,从而对控制制备好的样品润湿性的SiNWs表面能有深远影响。