Division of Chemistry and Chemical Engineering, California Institute of Technology, Pasadena, California 91125, USA.
J Am Chem Soc. 2013 Aug 14;135(32):11869-78. doi: 10.1021/ja4041779. Epub 2013 Jul 30.
Here we describe a multiplexed electrochemical characterization of DNA-bound proteins containing [4Fe-4S] clusters. DNA-modified electrodes have become an essential tool for the characterization of the redox chemistry of DNA repair proteins containing redox cofactors, and multiplexing offers a means to probe different complex samples and substrates in parallel to elucidate this chemistry. Multiplexed analysis of endonuclease III (EndoIII), a DNA repair protein containing a [4Fe-4S] cluster known to be accessible via DNA-mediated charge transport, shows subtle differences in the electrochemical behavior as a function of DNA morphology. The peak splitting, signal broadness, sensitivity to π-stack perturbations, and kinetics were all characterized for the DNA-bound reduction of EndoIII on both closely and loosely packed DNA films. DNA-bound EndoIII is seen to have two different electron transfer pathways for reduction, either through the DNA base stack or through direct surface reduction; closely packed DNA films, where the protein has limited surface accessibility, produce electrochemical signals reflecting electron transfer that is DNA-mediated. Multiplexing furthermore permits the comparison of the electrochemistry of EndoIII mutants, including a new family of mutations altering the electrostatics surrounding the [4Fe-4S] cluster. While little change in the midpoint potential was found for this family of mutants, significant variations in the efficiency of DNA-mediated electron transfer were apparent. On the basis of the stability of these proteins, examined by circular dichroism, we propose that the electron transfer pathway can be perturbed not only by the removal of aromatic residues but also through changes in solvation near the cluster.
在这里,我们描述了一种用于含有 [4Fe-4S] 簇的 DNA 结合蛋白的多重电化学生物特征分析。DNA 修饰电极已成为研究含有氧化还原辅因子的 DNA 修复蛋白的氧化还原化学的重要工具,而多重分析则提供了一种同时探测不同复杂样品和底物的方法,以阐明这种化学性质。对含有 [4Fe-4S] 簇的 DNA 修复蛋白内切酶 III(EndoIII)的多重分析表明,其电化学行为在不同 DNA 形态下存在细微差异。对紧密和松散堆积的 DNA 薄膜上 EndoIII 的 DNA 结合还原的峰分裂、信号宽度、对 π-堆积扰动的敏感性和动力学进行了特征描述。DNA 结合的 EndoIII 具有两种不同的还原电子转移途径,一种是通过 DNA 碱基堆积,另一种是通过直接表面还原;在蛋白质表面可及性有限的紧密堆积 DNA 薄膜中,产生的电化学信号反映了 DNA 介导的电子转移。多重分析还允许比较 EndoIII 突变体的电化学性质,包括一组改变 [4Fe-4S] 簇周围静电的新突变体家族。尽管该突变体家族的中点电位几乎没有变化,但 DNA 介导的电子转移效率的明显变化。基于这些蛋白质的稳定性,通过圆二色性进行了检测,我们提出电子转移途径不仅可以通过去除芳香族残基来干扰,还可以通过改变簇附近的溶剂化来干扰。