Research Center in Physics of Matter and Radiation-PMR, University of Namur, B-5000 Namur, Belgium.
Nanotechnology. 2013 Sep 6;24(35):355705. doi: 10.1088/0957-4484/24/35/355705. Epub 2013 Aug 12.
In this work, covalent modification of mono- and bilayer graphene is achieved using tetrafluoromethane (CF₄), oxygen and hydrogen RF plasma. Controlled modification of graphene is usually difficult to achieve, in particular with oxygen plasma, which is rather aggressive and usually leads to etching of graphene. Here we use x-ray photoelectron spectroscopy and Raman spectroscopy to show that mild plasma conditions and fine tuning of the number of functional groups can be obtained in all plasmas by varying parameters such as exposure time and sample position inside the chamber. We found that even for the usual harsh oxygen treatment the defect density could be lowered, down to one defect for 3.5 × 10⁴ carbon atoms. Furthermore, we show that CF₄ plasma leads to functionalization without etching and that graphene becomes an insulator at saturation coverage. In addition, the reactivity of mono- and bilayer graphene was studied revealing faster modification of monolayer in oxygen and CF₄ plasma, in agreement with previous works. In contrast, similar modification rates were observed for both mono- and bilayer during hydrogenation. We attribute this discrepancy to the presence of more energetic species in the hydrogen plasma such as positive ions that could play a role in the functionalization process.
在这项工作中,使用四氟甲烷 (CF₄)、氧气和氢气射频等离子体实现了单原子层和双原子层石墨烯的共价修饰。通常很难实现对石墨烯的可控修饰,特别是在氧气等离子体中,氧气等离子体具有很强的侵蚀性,通常会导致石墨烯的蚀刻。在这里,我们使用 X 射线光电子能谱和拉曼光谱表明,通过改变暴露时间和腔室内样品位置等参数,可以在所有等离子体中获得温和的等离子体条件和精细调整的官能团数量。我们发现,即使对于通常苛刻的氧气处理,也可以降低缺陷密度,降至每 3.5×10⁴ 个碳原子一个缺陷。此外,我们表明 CF₄ 等离子体可实现无蚀刻的功能化,并且石墨烯在饱和覆盖度下成为绝缘体。此外,还研究了单原子层和双原子层石墨烯的反应性,结果表明在氧气和 CF₄ 等离子体中单层的修饰速度更快,这与先前的工作一致。相比之下,在氢化过程中观察到单原子层和双原子层的类似修饰速率。我们将这种差异归因于氢气等离子体中存在更多高能物质,例如正离子,这些物质可能在功能化过程中发挥作用。