School of Mechanical Engineering and Birck Nanotechnology Center, Purdue University , 585 Purdue Mall, West Lafayette, Indiana 47907, United States.
Langmuir. 2013 Dec 23;29(51):15831-41. doi: 10.1021/la4045286. Epub 2013 Dec 12.
Evaporation rates are predicted and important transport mechanisms identified for evaporation of water droplets on hydrophobic (contact angle ~110°) and superhydrophobic (contact angle ~160°) substrates. Analytical models for droplet evaporation in the literature are usually simplified to include only vapor diffusion in the gas domain, and the system is assumed to be isothermal. In the comprehensive model developed in this study, evaporative cooling of the interface is accounted for, and vapor concentration is coupled to local temperature at the interface. Conjugate heat and mass transfer are solved in the solid substrate, liquid droplet, and surrounding gas. Buoyancy-driven convective flows in the droplet and vapor domains are also simulated. The influences of evaporative cooling and convection on the evaporation characteristics are determined quantitatively. The liquid-vapor interface temperature drop induced by evaporative cooling suppresses evaporation, while gas-phase natural convection acts to enhance evaporation. While the effects of these competing transport mechanisms are observed to counterbalance for evaporation on a hydrophobic surface, the stronger influence of evaporative cooling on a superhydrophobic surface accounts for an overprediction of experimental evaporation rates by ~20% with vapor diffusion-based models. The local evaporation fluxes along the liquid-vapor interface for both hydrophobic and superhydrophobic substrates are investigated. The highest local evaporation flux occurs at the three-phase contact line region due to proximity to the higher temperature substrate, rather than at the relatively colder droplet top; vapor diffusion-based models predict the opposite. The numerically calculated evaporation rates agree with experimental results to within 2% for superhydrophobic substrates and 3% for hydrophobic substrates. The large deviations between past analytical models and the experimental data are therefore reconciled with the comprehensive model developed here.
预测了液滴在疏水性(接触角约为 110°)和超疏水性(接触角约为 160°)基底上蒸发的速率,并确定了重要的输运机制。文献中用于液滴蒸发的分析模型通常简化为仅包括气相中的蒸汽扩散,并且假设系统是等温的。在本研究中开发的综合模型中,考虑了界面的蒸发冷却,并且将蒸汽浓度与界面处的局部温度耦合。在固体基底、液滴和周围气体中求解了共轭热和传质。还模拟了液滴和气相中的浮力驱动对流。定量确定了蒸发冷却和对流对蒸发特性的影响。蒸发冷却引起的液-气界面温度下降抑制了蒸发,而气相自然对流则增强了蒸发。虽然这些竞争输运机制的影响在疏水性表面上观察到相互平衡,但在超疏水性表面上蒸发冷却的更强影响导致基于蒸汽扩散的模型对实验蒸发速率的预测高估了约 20%。研究了疏水性和超疏水性基底上液-气界面的局部蒸发通量。由于靠近温度较高的基底,三相接触线区域的局部蒸发通量最大,而不是相对较冷的液滴顶部;基于蒸汽扩散的模型预测则相反。计算出的蒸发速率与实验结果的误差在 2%以内,适用于超疏水性基底,在 3%以内适用于疏水性基底。因此,过去的分析模型与实验数据之间的较大偏差与这里开发的综合模型相协调。