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制造带有嵌入式印刷银线的柔性基板的简便方法。

Facile method for fabricating flexible substrates with embedded, printed silver lines.

作者信息

Mahajan Ankit, Francis Lorraine F, Frisbie C Daniel

机构信息

Department of Chemical Engineering and Materials Science, University of Minnesota , Minneapolis, Minnesota 55455, United States.

出版信息

ACS Appl Mater Interfaces. 2014 Jan 22;6(2):1306-12. doi: 10.1021/am405314s. Epub 2013 Dec 31.

DOI:10.1021/am405314s
PMID:24320696
Abstract

Insertion, curing and delamination is presented as a simple and scalable method for creating flexible substrates with embedded, printed silver lines. In a sequential process, aerosol-jet printed silver lines are transferred from a donor substrate to a thin reactive polymer that is directly adhered to a flexible substrate. Due to the unique ability of the aerosol jet to print continuous lines on a low energy surface, a 100% transfer of the printed electrodes is obtained, as confirmed by electrical measurements. Moreover, the root-mean-square roughness of the embedded electrodes is less than 10 nm, which is much lower than that for their as-printed form. The embedded electrodes are robust and do not show a significant degradation in electrical performance after thousands of bending cycles.

摘要

插入、固化和分层被提出作为一种简单且可扩展的方法,用于制造带有嵌入式印刷银线的柔性基板。在一个连续过程中,气溶胶喷射印刷的银线从供体基板转移到直接粘附在柔性基板上的薄反应性聚合物上。由于气溶胶喷射在低能量表面上印刷连续线条的独特能力,经电学测量证实,印刷电极实现了100%的转移。此外,嵌入式电极的均方根粗糙度小于10纳米,远低于其印刷时的粗糙度。嵌入式电极坚固耐用,在数千次弯曲循环后其电性能没有明显下降。

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