Polymer Science Unit, Indian Association for the Cultivation of Science , Jadavpur, Kolkata 700032, India.
ACS Appl Mater Interfaces. 2014 Mar 12;6(5):3615-22. doi: 10.1021/am405868j. Epub 2014 Feb 12.
Co-assembled folic acid (F) gel with aniline (ANI) (ANI:F = 1:2, w/w) is produced at 2% (w/v) concentration in water/DMSO (1:1, v/v) mixture. The gel is rigid and on polymerization of the gel pieces in aqueous ammonium persulfate solution co-assembled folic acid - polyaniline (F-PANI) gel is formed. Both the co-assembled F-ANI and F-PANI gels have fibrillar network morphology, the fiber diameter and its degree of branching increase significantly from those of F gel. WAXS pattern indicates co-assembled structure with the F fiber at the core and ANI/PANI at its outer surface and the co-assembly is occurring in both F-ANI and F-PANI systems through noncovalent interaction of H-bonding and π stacking processes between the components. FTIR and UV-vis spectra characterize the doped PANI formation and the MALDI mass spectrometry indicates the degree of polymerization of polyaniline in the range 24-653. The rheological experiments support the signature of gel formation in the co-assembled state and the storage (G') and loss (G″) modulii increase in the order F gel< F-ANI gel < F-PANI gel, showing the highest increase in G' ≈ 1100% for the F-PANI gel. The stress at break, elasticity, and stiffness also increase in the same order. The dc-conductivity of F-ANI and F-PANI xerogels is 2 and 7 orders higher than that of F xerogel. Besides, the current (I)-voltage (V) curves indicate that the F-xerogel is insulator, but F-ANI xerogel is semiconductor showing both electronic memory and rectification; on the other hand, the F-PANI xerogel exhibits a negative differential resistance (NDR) property with a NDR ratio of 3.0.
将叶酸(F)与苯胺(ANI)以 1:2(质量比)共组装形成的凝胶(ANI:F = 1:2,质量比)在 2%(w/v)浓度的水/DMSO(1:1,体积比)混合物中制备。该凝胶为刚性凝胶,将凝胶块在水性过硫酸铵溶液中聚合,共组装形成叶酸-聚苯胺(F-PANI)凝胶。共组装的 F-ANI 和 F-PANI 凝胶均具有纤维状网络形态,纤维直径及其分支度显著增加。WAXS 图谱表明,共组装结构中 F 纤维为核心,ANI/PANI 为其外表面,F-ANI 和 F-PANI 体系中均通过氢键和π堆积过程的非共价相互作用发生共组装。FTIR 和 UV-vis 光谱表征了掺杂 PANI 的形成,MALDI 质谱表明聚苯胺的聚合度在 24-653 范围内。流变学实验支持共组装状态下凝胶形成的特征,储能模量(G')和损耗模量(G″)按 F 凝胶<F-ANI 凝胶<F-PANI 凝胶的顺序增加,表明 F-PANI 凝胶的 G'增加约 1100%。断裂应力、弹性和刚性也按相同顺序增加。F-ANI 和 F-PANI 干凝胶的直流电导率比 F 干凝胶高 2 到 7 个数量级。此外,电流(I)-电压(V)曲线表明 F-干凝胶为绝缘体,但 F-ANI 干凝胶为半导体,表现出电子记忆和整流特性;另一方面,F-PANI 干凝胶呈现出负微分电阻(NDR)特性,其 NDR 比为 3.0。