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湿度对纸质印刷电子产品功能的影响。

Impact of humidity on functionality of on-paper printed electronics.

机构信息

Center for Functional Materials, Turku, Finland. Paper Coating and Converting, Department of Chemical Engineering, Åbo Akademi University, Turku, Finland.

出版信息

Nanotechnology. 2014 Mar 7;25(9):094003. doi: 10.1088/0957-4484/25/9/094003. Epub 2014 Feb 12.

Abstract

A multilayer coated paper substrate, combining barrier and printability properties was manufactured utilizing a pilot-scale slide curtain coating technique. The coating structure consists of a thin mineral pigment layer coated on top of a barrier layer. The surface properties, i.e. smoothness and surface porosity, were adjusted by the choice of calendering parameters. The influence of surface properties on the fine line printability and conductivity of inkjet-printed silver lines was studied. Surface roughness played a significant role when printing narrow lines, increasing the risk of defects and discontinuities, whereas for wider lines the influence of surface roughness was less critical. A smooth, calendered surface resulted in finer line definition, i.e. less edge raggedness. Dimensional stability and its influence on substrate surface properties as well as on the functionality of conductive tracks and transistors were studied by exposure to high/low humidity cycles. The barrier layer of the multilayer coated paper reduced the dimensional changes and surface roughness increase caused by humidity and helped maintain the conductivity of the printed tracks. Functionality of a printed transistor during a short, one hour humidity cycle was maintained, but a longer exposure to humidity destroyed the non-encapsulated transistor.

摘要

采用中试规模的帘式涂布技术,制造出一种具有阻隔性能和印刷适性的多层涂布纸基材。该涂层结构由涂覆在阻隔层顶部的薄矿物颜料层组成。通过选择压延参数来调整表面性能,例如平滑度和表面孔隙率。研究了表面性能对喷墨打印银线的细线印刷适性和导电性的影响。当印刷窄线时,表面粗糙度起着重要作用,增加了缺陷和不连续性的风险,而对于较宽的线,表面粗糙度的影响则不那么关键。光滑的压延表面可实现更精细的线条定义,即边缘锯齿状更小。通过暴露在高低温湿度循环中,研究了尺寸稳定性及其对基底表面性能以及导电轨道和晶体管功能的影响。多层涂布纸的阻隔层减少了由湿度引起的尺寸变化和表面粗糙度增加,并有助于保持印刷轨道的导电性。在一个小时的短湿度循环中,印刷晶体管的功能得以维持,但长时间暴露在湿度下会破坏未封装的晶体管。

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