Polat Deniz B, Lu Jun, Abouimrane Ali, Keles Ozgul, Amine Khalil
Department of Metallurgical and Materials Engineering, Istanbul Technical University , Maslak, Istanbul, 34469, Turkey.
ACS Appl Mater Interfaces. 2014 Jul 23;6(14):10877-85. doi: 10.1021/am405994b. Epub 2014 Apr 8.
Two nanocolumnar structured porous Cu-Sn films were produced by tuning the duration of the process using an oblique angle deposition (OAD) technique of electron beam coevaporation method. The structural and morphological properties of these porous Cu-Sn films are characterized using thin film X-ray diffraction, scanning electron microcopy (SEM) and atomic force microscopy (AFM). Galvanostatic half-cell electrochemical measurements were conducted in between 5 mV to 2.5 V using a Li counter electrode, demonstrating that the Cu rich Cu6Sn5 thin film having homogenously distributed nanocolumns achieved a good cycleability up to 100 cycles with a high capacity retention, whereas the Cu6Sn5 nanostructured porous thick film with inhomogeneous morphology showed only a very short cycle life (<25 cycles).The difference in the electrochemical performances of the thin and thick nanocolumnar structured porous Cu-Sn films resulting from different evaporation duration was evaluated on the basis of X-ray photoelectron spectroscopy (XPS) analysis on the cycled samples.
通过使用电子束共蒸发法的倾斜角沉积（OAD）技术调整工艺持续时间，制备了两种纳米柱状结构的多孔铜锡薄膜。利用薄膜X射线衍射、扫描电子显微镜（SEM）和原子力显微镜（AFM）对这些多孔铜锡薄膜的结构和形态特性进行了表征。使用锂对电极在5 mV至2.5 V之间进行恒电流半电池电化学测量，结果表明，具有均匀分布纳米柱的富铜Cu6Sn5薄膜在高达100次循环中具有良好的循环稳定性和高容量保持率，而形态不均匀的Cu6Sn5纳米结构多孔厚膜仅显示出非常短的循环寿命（<25次循环）。基于对循环样品的X射线光电子能谱（XPS）分析，评估了不同蒸发持续时间导致的薄和厚纳米柱状结构多孔铜锡薄膜电化学性能的差异。
