Dominic A, Sarangan J, Suresh S, Sai Monica
J Nanosci Nanotechnol. 2014 Mar;14(3):2368-76. doi: 10.1166/jnn.2014.8543.
The high density heat removal in electronic packaging is a challenging task of modern days. Finding compact, energy efficient and cost effective methods of heat removal is being the interest of researchers. In the present work, mini channel with forced convective heat transfer in simultaneously developing regime is investigated as the heat transfer coefficient is inversely proportional to hydraulic diameter. Mini channel heat sink is made from the aluminium plate of 30 mm square with 8 mm thickness. It has 15 mini channel of 0.9 mm width, 1.3 mm height and 0.9 mm of pitch. DI water and water based 0.1% and 0.2% volume fractions of Al2O3/water nanofluids are used as coolant. The flow rates of the coolants are maintained in such a way that it is simultaneously developing. Reynolds number is varied from 400 to 1600 and heat input is varied from 40 W to 70 W. The results showed that heat transfer coefficient is more than the heat transfer coefficient of fully developed flow. Also the heat transfer is more for nanofluids compared to DI water.
电子封装中的高密度散热是当今一项具有挑战性的任务。寻找紧凑、节能且经济高效的散热方法一直是研究人员的兴趣所在。在当前工作中，研究了同时发展区域内具有强制对流换热的微通道，因为传热系数与水力直径成反比。微通道散热器由一块边长30毫米、厚度8毫米的铝板制成。它有15个宽度为0.9毫米、高度为1.3毫米、间距为0.9毫米的微通道。去离子水以及体积分数为0.1%和0.2%的水基Al2O3/水纳米流体用作冷却剂。冷却剂的流速保持在同时发展的状态。雷诺数从400变化到1600，热输入从40瓦变化到70瓦。结果表明，传热系数高于充分发展流动时的传热系数。而且与去离子水相比，纳米流体的传热效果更好。
