Thermal performance of dual flow slotted fin mini channel heat sink using AlO-HO and TiO-HO: a numerical and experimental approach.

To overcome the extensive heat generation inside the microprocessors nanofluids have gained importance because of their better thermophysical properties as compared with air and water. This work proposes a two-pronged strategy for thermal performance enhancement of mini channel heat sinks. Firstly, a novel dual flow slotted fin mini channel heat sink flow configuration is proposed. Secondly, a detailed numerical investigation is performed to assess heat transfer enhancement property of AlO-HO and TiO-HO nanofluids. Considering the first step, fin spacing, number of slots, slot thickness and slot angle are investigated in detail yielding to the selection of best structural parameters. Two slots per fin of 0.5 mm thickness at an angle of 45° is selected because it provides better thermal performance as compared with water. Further, numerical assessment of nano fluid behavior was carried out at volumetric concentrations of 0.005% and 0.01%. For the case of novel dual flow slotted fin mini channel heat sink, maximum numerical and experimental advantages in all targeted system properties is observed for AlO-HO nano fluid at volumetric concentration of 0.01%, as compared with water. AlO-HO nano fluid provides better thermal performance both numerically and experimentally as compared with TiO-HO nanofluids. Increment in the pressure drop is noted with increasing volumetric concentrations.