Potapov P L
GLOBALFOUNDRIES Dresden, Module 1, CCA, Wilschdorfer Landstrasse 101, 01109 Dresden, Germany.
Ultramicroscopy. 2014 Dec;147:21-4. doi: 10.1016/j.ultramic.2014.05.010. Epub 2014 Jun 11.
The electron mean-free-path in Si was measured by EELS using the test structure with the certified dimensions as a calibration standard. In a good agreement with the previous CBED measurements, the mean-free-path is 150nm for 200keV and 179nm for 300keV energy of primary electrons at large collection angles. These values are accurately predicted by the model of Iakoubovskii et al. while the model of Malis et al. incorporated in common microscopy software underestimates the mean-free-path by 15% at least. Correspondingly, the thickness of TEM samples reported in many studies of the Si-based materials last decades might be noticeably underestimated.
利用具有经认证尺寸的测试结构作为校准标准,通过电子能量损失谱(EELS)测量了硅中的电子平均自由程。与之前的会聚束电子衍射(CBED)测量结果高度一致,在大收集角下,对于200keV的一次电子,平均自由程为150nm,对于300keV的一次电子,平均自由程为179nm。Iakoubovskii等人的模型准确地预测了这些值,而常见显微镜软件中纳入的Malis等人的模型至少低估了平均自由程15%。相应地,在过去几十年对硅基材料的许多研究中报道的透射电子显微镜(TEM)样品厚度可能被明显低估。