Chen Hongfei, Fu Dongjie, Yang Hongye, Liu Yinchen, Huang Yanyu, Huang Cui
The State Key Laboratory Breeding Base of Basic Science of Stomatology (Hubei-MOST) & Key Laboratory of Oral Biomedicine Ministry of Education, School & Hospital of Stomatology, Wuhan University, Wuhan, China.
Eur J Oral Sci. 2014 Aug;122(4):286-92. doi: 10.1111/eos.12140. Epub 2014 Jun 25.
The aim of this study was to investigate the effects of different direct current intensities on dentine bonding effectiveness of Clearfil S(3) Bond and on cell viability of human dental pulp cells (HDPCs). Thirty-five-third molars were sectioned and ground to provide flat surfaces. Clearfil S(3) Bond was applied under different current conditions for 30 s and then resin composite was built up. Specimens were processed for microtensile bond strength (µTBS) testing and for nanoleakage investigation using scanning electron microscopy. Primary HDPCs isolated from premolars were stimulated with different intensities of electric current for 30 s. Then, cell viability was tested using the 3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyl tetrazolium bromide (MTT) assay. Specimens bonded with application of electrical current intensities of 50, 60, 70, and 90 µA exhibited a significant increase in immediate µTBS compared with all other groups. Bonded interfaces prepared using electrically assisted current application showed reduced interfacial nanoleakage upon scanning electron microscopy. Electric current application, from 20 to 70 µA, had no effect on the viability of HDPCs. This study provides further evidence for its future clinical use.
本研究的目的是探讨不同直流电流强度对Clearfil S(3) Bond牙本质粘结效果以及对人牙髓细胞(HDPCs)细胞活力的影响。将35颗第三磨牙进行切片和研磨以获得平整表面。在不同电流条件下施加Clearfil S(3) Bond 30秒,然后堆积树脂复合材料。对标本进行微拉伸粘结强度(µTBS)测试以及使用扫描电子显微镜进行纳米渗漏研究。从第一前磨牙分离的原代HDPCs用不同强度的电流刺激30秒。然后,使用3-(4,5-二甲基噻唑-2-基)-2,5-二苯基溴化四氮唑(MTT)法测试细胞活力。与所有其他组相比,在施加50、60、70和90 µA电流强度下粘结的标本在即时µTBS方面有显著增加。使用电辅助电流施加制备的粘结界面在扫描电子显微镜下显示出界面纳米渗漏减少。施加20至70 µA的电流对HDPCs的活力没有影响。本研究为其未来的临床应用提供了进一步的证据。