Kawakami T, Ibaraki Y, Haraguchi K, Odachi H, Kawamura H, Kubota M, Miyata T, Watanabe T, Iioka A, Nittono M
Higashi Nihon Shigaku Zasshi. 1989 Jun;8(1):57-62.
Recently, sedative and antiphlogistic treatment is conducted with low energy laser irradiation. The purpose of the this study was to evaluate the effectiveness to decrease of pain just after irradiation by a GaA1As semiconductor laser. The irradiation apparatus was SEMI LASER NANOX (LX-800: G-C. Co.) with the following features: a wave length of (around) 780nm: the laser energy, 30mW; exposure time, 30sec to 180sec/per treatment. Diagnosis of pre- and post-operative sensitivity were classified into the following four grades: Grade 0 no pain. Grade I mild pain. Grade II strong but tolerable pain. Grade III intolerable pain (simultaneous with stimulation). The results were as follows: 1. In the hypersensitivity of dentin, the treatment was not effective with 2 cases of grade III, but with all of grade I, II (35 cases) the pain decreased just after irradiation. 2. It was effective in all cases with pain like periodontitis after root canal filling and pain after extraction of teeth. 3. It was effective in all cases with gingivitis, stomatitis, and gingival ulcers after infiltration anesthesia etc..
最近，采用低能量激光照射进行镇静和抗炎治疗。本研究的目的是评估GaA1As半导体激光照射后即刻减轻疼痛的效果。照射设备为SEMI LASER NANOX（LX - 800：G - C. Co.），具有以下特点：波长约780nm；激光能量30mW；每次治疗的照射时间为30秒至180秒。术前和术后敏感性诊断分为以下四个等级：0级无疼痛；I级轻度疼痛；II级强烈但可耐受的疼痛；III级无法耐受的疼痛（与刺激同时出现）。结果如下：1. 在牙本质过敏症中，3例III级病例治疗无效，但所有I级、II级病例（35例）照射后疼痛减轻。2. 对根管充填后牙周炎样疼痛和拔牙后疼痛的所有病例均有效。3. 对浸润麻醉后牙龈炎、口腔炎和牙龈溃疡的所有病例均有效。
